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300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch

300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch

News Nov 13, 2017 by Paul Shepard
ON Semiconductor Reports Expanding Margins in Q3 2017

ON Semiconductor Reports Expanding Margins in Q3 2017

News Nov 06, 2017 by Paul Shepard
SiC Devices, Power in 3D Packaging, and More at IEDM 2017

SiC Devices, Power in 3D Packaging, and More at IEDM 2017

News Nov 01, 2017 by Paul Shepard
Switch 100kVA at 50kHz with SiC Power Evaluation Platform

Switch 100kVA at 50kHz with SiC Power Evaluation Platform

News Oct 23, 2017 by Paul Shepard
Cree aiming to Double SiC Capacity at Wolfspeed

Cree aiming to Double SiC Capacity at Wolfspeed

News Oct 19, 2017 by Paul Shepard
Sumitomo Electric Launches 99% Defect Free SiC Epitaxial Wafers

Sumitomo Electric Launches 99% Defect Free SiC Epitaxial Wafers

News Oct 12, 2017 by Paul Shepard
Danfoss Preparing for Production of SiC Power Modules in NY

Danfoss Preparing for Production of SiC Power Modules in NY

News Oct 09, 2017 by Paul Shepard
Dialog Semiconductor to Acquire Silego Technology

Dialog Semiconductor to Acquire Silego Technology

News Oct 05, 2017 by Paul Shepard
PPM Power Signs Power Modules and SiC Agreement with SanRex

PPM Power Signs Power Modules and SiC Agreement with SanRex

News Sep 30, 2017 by Paul Shepard
Dr. Hiroyuki Matsunami Wins Honda Prize for Pioneering SiC Research

Dr. Hiroyuki Matsunami Wins Honda Prize for Pioneering SiC Research

News Sep 27, 2017 by Paul Shepard
Mitsubishi Develops SiC Power Device with Record Power Efficiency

Mitsubishi Develops SiC Power Device with Record Power Efficiency

News Sep 21, 2017 by Paul Shepard
Ascatron enters SiC Power Device Market with Diodes up to 10kV

Ascatron enters SiC Power Device Market with Diodes up to 10kV

News Sep 18, 2017 by Paul Shepard
SDK to Expand Capacity for High-Grade SiC Epitaxial Wafers

SDK to Expand Capacity for High-Grade SiC Epitaxial Wafers

News Sep 14, 2017 by Paul Shepard
New Process for Making SiC Power Devices Opens Market to More Competition

New Process for Making SiC Power Devices Opens Market to More Competition

News Sep 14, 2017 by Paul Shepard
Newly-Discovered Semiconductor Dynamics May Help Improve Energy Efficiency

Newly-Discovered Semiconductor Dynamics May Help Improve Energy Efficiency

News Sep 11, 2017 by Paul Shepard
Signing Seals Compound Semiconductor Cluster in South-East Wales

Signing Seals Compound Semiconductor Cluster in South-East Wales

News Sep 11, 2017 by Paul Shepard
IEEE Rates Peregrine Semiconductor as a Leader in “Patent Power”

IEEE Rates Peregrine Semiconductor as a Leader in “Patent Power”

News Sep 07, 2017 by Paul Shepard
Compound Semiconductor Applications Catapult appoints CEO

Compound Semiconductor Applications Catapult appoints CEO

News Sep 02, 2017 by Paul Shepard
Pressureless Sinter Joining for Next-Gen GaN & SiC Power Semis

Pressureless Sinter Joining for Next-Gen GaN & SiC Power Semis

News Sep 01, 2017 by Paul Shepard
S3semi sets Custom Mixed-Signal IC Strategy for Industrial Systems

S3semi sets Custom Mixed-Signal IC Strategy for Industrial Systems

News Aug 30, 2017 by Paul Shepard