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System Level Impact of GaN in Server Architectures

System Level Impact of GaN in Server Architectures


News Dec 20, 2016 by Jeff Shepard
400V Vertical GaN Transistor Switches 15A in 40ns

400V Vertical GaN Transistor Switches 15A in 40ns


News Dec 19, 2016 by Jeff Shepard
MACOM Announces Preliminary Injunction against Infineon

MACOM Announces Preliminary Injunction against Infineon


News Dec 19, 2016 by Jeff Shepard
Transphorm’s Fully-Packaged GaN FETs Available Through Digi-Key

Transphorm’s Fully-Packaged GaN FETs Available Through Digi-Key


News Dec 15, 2016 by Jeff Shepard
Atomera to Discuss Semiconductor Materials Advancements

Atomera to Discuss Semiconductor Materials Advancements

Fabless Actions Semiconductor Going Private

Fabless Actions Semiconductor Going Private


News Dec 12, 2016 by Jeff Shepard
High Performance Analog offers Superior Noise Performance

High Performance Analog offers Superior Noise Performance


News Dec 07, 2016 by Jeff Shepard
£10 Million Award Creates Compound Semiconductor Hub

£10 Million Award Creates Compound Semiconductor Hub


News Dec 06, 2016 by Jeff Shepard
InSe Semiconductors Could Extend Life of Moore’s Law

InSe Semiconductors Could Extend Life of Moore’s Law


News Dec 06, 2016 by Jeff Shepard
3D Solutions to Energy Savings in Silicon IGBTs

3D Solutions to Energy Savings in Silicon IGBTs


News Dec 04, 2016 by Jeff Shepard
Infineon Adds GaN Cleanroom in Arizona

Infineon Adds GaN Cleanroom in Arizona


News Dec 04, 2016 by Jeff Shepard
ON Semi to Debut Scalable Platform for Wearables

ON Semi to Debut Scalable Platform for Wearables

Next Generation Electric Machines get nearly $25 Million

Next Generation Electric Machines get nearly $25 Million


News Nov 27, 2016 by Jeff Shepard
SMIC Opens Analog and Specialty Semiconductor Subsidiary

SMIC Opens Analog and Specialty Semiconductor Subsidiary


News Nov 27, 2016 by Jeff Shepard
Spray-Printed Crystals for Organic Electronic Applications

Spray-Printed Crystals for Organic Electronic Applications


News Nov 21, 2016 by Jeff Shepard
New Method to Dissipate Heat in Electronic Devices

New Method to Dissipate Heat in Electronic Devices


News Nov 21, 2016 by Jeff Shepard
GaN used to Design 2.5MHz 3kW Resonant DC-DC

GaN used to Design 2.5MHz 3kW Resonant DC-DC


News Nov 17, 2016 by Jeff Shepard
Fourth-Generation GaAs Solar Cells are 53 Microns Thick

Fourth-Generation GaAs Solar Cells are 53 Microns Thick


News Nov 16, 2016 by Jeff Shepard
Ultra-Thin Substrate with Integrated ESD Protection

Ultra-Thin Substrate with Integrated ESD Protection

Low-Power, Long-Range Radio Chip for IoT

Low-Power, Long-Range Radio Chip for IoT


News Nov 14, 2016 by Jeff Shepard