Calls for Papers Include Shanghai, China, and San Jose, CaliforniaFebruary 29, 2012 by Jeff Shepard
Darnell Group has issued a Call for Papers for the first-annual Darnell’s Power China conference, to be hosted in Shanghai in May, and for the ninth-annual Darnell’s Power Forum to be hosted in San Jose, California in September.
"Shanghai is a major research and design center for all types of power converters, and understanding the latest developments in advanced components and design techniques is increasingly important in this community of power engineers making it the ideal location to launch Darnell’s Power China," stated Jeff Shepard, President of Darnell Group. "And Darnell’s Power Forum is well-established as THE Fall meeting in the Silicon Valley for the global power electronics community."
Darnell’s Power Forum will feature six primary areas of focus: Advanced Components, Digital Power, Energy Harvesting, High-Efficiency Power Conversion, Innovation for the Smart Grid and Portable Power. Within each of these broad areas will be multiple topics and application areas.
Building on the success of Darnell’s Power Forum, hosted annually for the past nine years, DPC will be a Chinaspecific, two-day conference that will serve an international audience of decision makers who are interested in learning about and contributing to the latest practical advancements in advanced power conversion components, topologies, architectures and design tools/techniques. The emphasis at DPC will be practical solutions to today’s design challenges. The content and structure of the forum will be guided by a predominantly Chinese Advisory Committee, and will represent the specific interests and needs of Chinese power converter makers and original equipment manufacturers.
Darnell’s Power China 2012 will feature five primary areas of focus: Advanced Components, Digital Power, High- Efficiency Power Conversion, Innovation for Micro Grids and Renewable Energy, and PwrSiP/PwrSoC.
Advanced Components: Topics may include: Latest developments in power conversion components to support advanced designs such as, semiconductor devices, advanced packaging, interconnect, thermal management, magnetic devices, capacitors, batteries, ultracapacitors, sensors, new materials, integrated passives, and so on.
Digital Power: Topics may include: Technology-focused discussions including controllers and control loops, communications, power management, stability analysis, efficiency optimization, design tools, simulation and modeling, topologies, system partitioning between analog and digital, power quality and EMC, and so on.
High-Efficiency Power Conversion: Topics may include: High-frequency power conversion, high-temperature operation, power system-in-chip solutions, power system-in-package solutions, high-density packaging developments, optimizing converter efficiencies, new topologies, advanced (analog or digital) control techniques, parasitics, EMI/EMC considerations, and so on.
Innovations for Micro Grids and Renewable Energy: Topics may include: Integration of distributed generation resources, micro grids, power systems communications, power quality, instrumentation and monitoring, enabling demand side management, supporting plug-in hybrid vehicles, large scale energy storage, advanced metering infrastructure, visualization technologies, real-time control methods, and so on.
PwrSiP/PwrSoC: Topics may include: miniaturization and integration of passive components, advances in highfrequency power conversion, new topologies and architectures, developments in packaging, multi-Megahertz switching, efficiency optimization, and so on.
In each case, the types of papers being sought include: Case studies/industry examples, Design techniques and tools, and Technology developments.