New Industry Products

Toshiba Launches Low-height SO6L Package Gate-drive Photocouplers

January 27, 2014 by Jeff Shepard

Toshiba Corporation announced the launch of low-height SO6L package gate-drive photocouplers for use in driving small- to medium-power IGBTs and power MOSFETs. The new products, TLP5701 for driving small-power IGBTs and TLP5702 for driving middle-power IGBTs, are the first Toshiba photocouplers to use the low-height SO6L package. At only 54% of Toshiba products that use the SDIP6 package, the new devices will contribute to development of thinner sets. In spite of their low height, the devices guarantee a creepage distance of 8mm, making them suitable for applications requiring higher isolation specs.

The TLP5701 and TLP5702 achieve low supply current of 2.0mA (max) and low power consumption by utilizing BiCMOS process technology. Combined with an original high-power, high-reliability infrared LED, they can be used in a wide range of applications, including those that require high thermo-stability, such as factory automation and home photovoltaic power systems, digital home appliances and control equipment. Maximum propagation delay time and propagation delay skew are guaranteed within the defined operation temperature range (up to 110 degrees Centigrade), making it possible to reduce dead time in the inverter circuit, which can secure higher operating efficiency.

The TLP5701 is targeted to drive MOSFETs and IGBTs up to about 20A rating in inverters, uninterruptible power supplies, servos, air conditioners, home appliances and similar applications. It has a supply voltage rating of 10V to 30V, a peak output current capability of 0.6A, maximum and a propagation delay time of 500 nsec, maximum. The TLP5702 which has a supply voltage rating of 15V to 30V, a peak output current rating of 2.5A and a propagation delay of 200 nsec is targeted for use in power MOSFETs and IGBTs up to about 80A. It is expected to find use in photovoltaic inverters uninterruptible power supplies, ac servos, induction cooking and other applications.