Semtech Unveils µClamp3324P ESD Protection Device
Semtech Corp. (Camarillo, CA), a producer of analog and mixed-signal semiconductors, announced its new µClamp3324P, a low-voltage, four-line electrostatic discharge (ESD) protection device that features packaging and design innovations for an ultra-small size and simplified board layout. Designed for cell phones, digital still cameras, notebook computers, and other portable systems, the µClamp3324P provides low working and clamping voltage for protection of sensitive ICs in high ESD threat environments.
Part of Semtech’s MicroClamp™ ESD protection family, the µClamp3324P is a 3.3 V device that comes in the new SLP2116P8 lead-less package, which measures 2.1 mm x 1.6 mm x 0.58 mm. The µClamp3324P has a flow-through design that enables it to be used near connectors simplifying board design when compared to competitive multi-line ESD protection devices that require significant board redesign. The µClamp3324P replaces four discrete devices (such as multi-layer varistors), reducing the space needed for ESD protection by 77 percent. Internally, the device is constructed using Semtech’s patented EPD TVS process technology, yielding 3.3 V operating devices. The lead-less design, along with a large ground pad at the bottom of the device, reduces the parasitic inductance for better IC protection. The device exceeds the IEC protection standards for ESD and electrical fast transient protection.
The lead-free design of the device meets worldwide environmental and regulatory requirements, including the European Union’s Restriction on Hazardous Substances in Electrical and Electronic Equipment directive. The µClamp3324P is now available in production quantities, and is priced at $0.41 each in 1,000-piece lots. Ordering code is µClamp3324P.TCT.
