TO-Leadless Packaging with Low Parasitics for 40V / 400A Applications

October 02, 2018 by Paul Shepard

Alpha and Omega Semiconductor Limited (AOS) has introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class. The TOLL package has the highest current capacity because of AOS’ innovative technology which utilizes a clip to achieve the 400Adc at 25°C capability.

The TOLL packaging technology offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.

The AOTL66401 (40V) has a 30% smaller footprint compared to a TO-263 (D2PAK) package, including having higher current carry capability that enables the designer to reduce the number of devices in parallel.

This new device offers a higher power density in comparison to existing solutions, and is well suited for industrial BLDC motor applications and battery management to reduce the number of MOSFETs. The AOTL66401 has a 0.7mOhm max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature.

The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.

“With the significant performance improvement, the TOLL with clip technology is a robust package which enables low package parasitics reducing EMI. The AOTL66401 simplifies new designs with the higher current density to enable savings in overall system cost due to a reduced number of devices in parallel. AOS’ TOLL package is best suited for high power applications,” said Peter H. Wilson.

The AOTL66401 is immediately available in production quantities with a lead-time of 12-14 weeks. The unit price for 1,000 pieces is $3.90.