ST Assembly Test Services Ltd. (STATS, Singapore) has rolled out a new dual-row version of its quad leadless package that delivers higher I/O performance. The company said that its Dual Row Quad Leadless Package (QLP-DR) features an expanded number of I/O terminal pads in a smaller footprint. The lead frame design of the QLP-DR features two rows of staggered I/O terminal pads with an exposed die pad for die grounding and improved thermal performance.
The QLP packages are also available with non-exposed pads to enable higher-density, board-level routing. The QLP-DR uses the same assembly and test process as the STATS standard quad leadless package. The new package is a lead-free/green package that is more cost effective than laminate-based packages, according to the company.
