Quantum Leap Packaging Secures Series A Funding

November 09, 2003 by Jeff Shepard

Quantum Leap Packaging (Wilmington, MA), a developer of low-cost, high-performance, liquid crystal polymer (LCP) packaging solutions for high-volume electronic and optical components, announced that it has received $3.5 million in Series A financing from Battery Ventures (San Mateo, CA). As part of the investment, Battery Venture's Morgan Jones has joined the company's board of directors. Quantum Leap will use the investment to support its product development, marketing and business development initiatives.

Quantum Leap Packaging's low-cost LCP package technology replaces expensive ceramic and metal packaging and provides significant advantages in thermal performance, electrical performance, and precision. Quantum Leap's packaging solutions are designed for high-growth applications including RF transistors, image sensors, vision packages, MEM devices, semiconductors and fiber optic modules.