Ericsson (Sweden) Technology Licensing announced a licensing agreement with Winbond Electronics Corp. (Taiwan), a semiconductor manufacturer. The license agreement covers the Ericsson Core Bluetooth Radios KE-1 and KD-1. The license agreement enables Winbond to design and manufacture complete Bluetooth solutions together with a proprietary baseband. Winbond can tailor Ericsson's solutions for all of the major Bluetooth applications such as human interface devices, headsets and mobile phones.
"This deal is important to us because Winbond is a leading company within Asian semiconductor design and manufacturing," said Maria Khorsand, president of Ericsson Technology Licensing. "We strongly believe that Winbond, due to its leading position, will penetrate the Taiwanese market with Bluetooth solutions. In addition, thanks to Winbond's strong global presence, Winbond will become a key player in the Bluetooth adoption rate worldwide."
