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Navitas Announces “GaNFast™: The Future is Now” at PCIM 2018

Navitas Announces “GaNFast™: The Future is Now” at PCIM 2018

News May 30, 2018 by Paul Shepard
Eta Research Develops Free-Standing GaN Substrates

Eta Research Develops Free-Standing GaN Substrates

News May 30, 2018 by Paul Shepard
Littelfuse to Exhibit Growing Power Semiconductor Portfolio at PCIM

Littelfuse to Exhibit Growing Power Semiconductor Portfolio at PCIM

News May 30, 2018 by Paul Shepard
Ultra-High Voltage Foundry Process for Industrial and Power Applications

Ultra-High Voltage Foundry Process for Industrial and Power Applications

News May 29, 2018 by Paul Shepard
Low-Inductance Package Optimized for High-Frequency SiC MOSFET Technology

Low-Inductance Package Optimized for High-Frequency SiC MOSFET Technology

News May 29, 2018 by Paul Shepard
GaN Systems to Showcase Customer Solutions at PCIM Europe 2018

GaN Systems to Showcase Customer Solutions at PCIM Europe 2018

News May 25, 2018 by Paul Shepard
Silicon Breakthrough Could Make Key Microwave Technology Cheaper and Better

Silicon Breakthrough Could Make Key Microwave Technology Cheaper and Better

News May 25, 2018 by Paul Shepard
Bluetooth LE Smartwatch Development Platform

Bluetooth LE Smartwatch Development Platform

News May 24, 2018 by Paul Shepard
Advanced Automotive-Qualified Production FD-SOI Process Technology

Advanced Automotive-Qualified Production FD-SOI Process Technology

News May 23, 2018 by Paul Shepard
Silicon Carbide enables 30kW Three-Phase Vienna PFC Reference Design

Silicon Carbide enables 30kW Three-Phase Vienna PFC Reference Design

News May 22, 2018 by Paul Shepard
Infineon Investing €1.6 Billion in 300-Millimeter Chip Factory in Austria

Infineon Investing €1.6 Billion in 300-Millimeter Chip Factory in Austria

News May 18, 2018 by Paul Shepard
GaN Enables Software-Defined Switch-Mode RF Power Amplifiers

GaN Enables Software-Defined Switch-Mode RF Power Amplifiers

News May 18, 2018 by Paul Shepard
One-Dimensional Material Packs a Current Density 50X Greater than Copper

One-Dimensional Material Packs a Current Density 50X Greater than Copper

News May 17, 2018 by Paul Shepard
GTAT to Showcase Six-Inch SiC Wafers and More at SNEC 2018 PV Power Expo

GTAT to Showcase Six-Inch SiC Wafers and More at SNEC 2018 PV Power Expo

News May 16, 2018 by Paul Shepard
II-VI Incorporated Opens New Epi Wafer Facility

II-VI Incorporated Opens New Epi Wafer Facility

News May 15, 2018 by Paul Shepard
Seoul Semiconductor AC LED Modules Pass 4kV Surge Testing

Seoul Semiconductor AC LED Modules Pass 4kV Surge Testing

News May 14, 2018 by Paul Shepard
Surface-Mount IPMs for Low-Cost Inverter Systems Coming to Market

Surface-Mount IPMs for Low-Cost Inverter Systems Coming to Market

News May 14, 2018 by Paul Shepard
Toshiba to Exhibit Multiple New Products at PCIM Europe

Toshiba to Exhibit Multiple New Products at PCIM Europe

News May 13, 2018 by Paul Shepard
TDK Acquires Faraday Semi to Bolster Power Solutions with, Si, GaN & 3D Packaging

TDK Acquires Faraday Semi to Bolster Power Solutions with, Si, GaN & 3D Packaging

News May 09, 2018 by Paul Shepard
PowerBase Pushing for High-Voltage GaN Power Devices

PowerBase Pushing for High-Voltage GaN Power Devices

News May 05, 2018 by Paul Shepard