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AI-Enhanced Power Recovery Design Platform Delivers Results 5X Faster

AI-Enhanced Power Recovery Design Platform Delivers Results 5X Faster

News Jun 10, 2018 by Paul Shepard
Honda Partners on General Motors’ Next-Gen Battery Development

Honda Partners on General Motors’ Next-Gen Battery Development

News Jun 09, 2018 by Paul Shepard
Wireless Power Market Advances with GaN Systems’ 100W and 300W Solutions

Wireless Power Market Advances with GaN Systems’ 100W and 300W Solutions

News Jun 08, 2018 by Paul Shepard
Enhancement-Mode Vertical Gallium-Oxide Transistor with Breakdown >1kV

Enhancement-Mode Vertical Gallium-Oxide Transistor with Breakdown >1kV

News Jun 07, 2018 by Paul Shepard
Infineon Previews 400V and 600V GaN Switches & Galvanically-Isolated Drivers

Infineon Previews 400V and 600V GaN Switches & Galvanically-Isolated Drivers

News Jun 07, 2018 by Paul Shepard
Type-C Port Manager Software Eases Migration to USB-PD 3.0 Power Delivery

Type-C Port Manager Software Eases Migration to USB-PD 3.0 Power Delivery

News Jun 07, 2018 by Paul Shepard
VisIC Technologies Raises $10M to Speed GaN Market Adoption

VisIC Technologies Raises $10M to Speed GaN Market Adoption

News Jun 07, 2018 by Paul Shepard
GaN enables Seasonic’s 1.6kW Bridgeless Totem-Pole PFC Platform

GaN enables Seasonic’s 1.6kW Bridgeless Totem-Pole PFC Platform

News Jun 07, 2018 by Paul Shepard
Sonics Partners with Synkom to Bring Energy Processing Unit IP to Japan

Sonics Partners with Synkom to Bring Energy Processing Unit IP to Japan

News Jun 06, 2018 by Paul Shepard
NXP Brings Standard Packages to RF Power for Simplified Design and Manufacturing

NXP Brings Standard Packages to RF Power for Simplified Design and Manufacturing

News Jun 06, 2018 by Paul Shepard
Leclanché Funding Round includes CHF 50 Million for Acquisitions and JVs

Leclanché Funding Round includes CHF 50 Million for Acquisitions and JVs

News Jun 06, 2018 by Paul Shepard
Evaluation Board for Three-Phase BLDC Motor Drive ICs

Evaluation Board for Three-Phase BLDC Motor Drive ICs

News Jun 06, 2018 by Paul Shepard
Power Integrations’ SCALE-iDriver ICs Now with AEC-Q100 Certification

Power Integrations’ SCALE-iDriver ICs Now with AEC-Q100 Certification

News Jun 05, 2018 by Paul Shepard
Crypto Dev Kit Simplifies Development of Secure Connected IoT Nodes

Crypto Dev Kit Simplifies Development of Secure Connected IoT Nodes

News Jun 05, 2018 by Paul Shepard
ROHM to Expand Production Capacity of SiC Power Devices

ROHM to Expand Production Capacity of SiC Power Devices

News Jun 05, 2018 by Paul Shepard
Double DPAK Top-Side Cooled SMD Solution for High-Power Applications

Double DPAK Top-Side Cooled SMD Solution for High-Power Applications

News Jun 05, 2018 by Paul Shepard
ROHM and GaN Systems Join Forces for GaN Power Semiconductors

ROHM and GaN Systems Join Forces for GaN Power Semiconductors

News Jun 04, 2018 by Paul Shepard
High-Power Semiconductor Probing System

High-Power Semiconductor Probing System

News Jun 04, 2018 by Paul Shepard
Precision Acquisition expands TT’s Electromagnetic Capabilities

Precision Acquisition expands TT’s Electromagnetic Capabilities

News Jun 04, 2018 by Paul Shepard
Wireless System can Power Multiple Devices Inside the Body

Wireless System can Power Multiple Devices Inside the Body

News Jun 03, 2018 by Paul Shepard