New Industry Products

New SiC Power Modules and Fab Capacity Expansion

November 05, 2023 by Mike Falter

STMicroelectronics is releasing its latest silicon carbide power module for EVs and other high-voltage applications, while onsemi completes the expansion of a key SiC fabrication facility in pursuit of a fully integrated SiC supply chain. 

STMicroelectronics is releasing the first model of its ACEPACK DMT-32 series of silicon carbide (SiC) power modules designed for DC-DC conversion applications in electric vehicle (EV) onboard chargers, auxiliary systems, and other high-voltage applications. 


SiC power modules for EV charging and auxiliary applications.

SiC power modules for EV charging and auxiliary applications. Image used courtesy of ST


The modules are constructed with ST’s latest SiC MOSFET technologies and are designed for high-voltage power conversion circuits. Modules will be available in multiple bridge configurations, including six-pack, four-pack, and totem pole. A low on-resistance combined with an aluminum nitride (AlN) insulated substrate improves thermal performance and allows for higher solution power densities.

Additionally, as part of its efforts to develop a fully integrated, vertical SiC supply chain, onsemi has completed the expansion of its SiC wafer fabrication and epitaxy (EPI)facility in Bucheon, South Korea. The facility is designed to produce 150 mm and 200 mm SiC wafers with a capacity of one million wafers per year. 


Silicon Carbide Power Module

The ACEPACK DMT-32 series from STMicroelectronics is a family of SiC power modules available in a 32-pin, molded, through-hole package and certified for automotive applications. The modules are constructed with SiC MOSFET power switches based on ST’s second and third-generation process technologies. They are available in several standard bridge configurations – four-pack, six-pack, and totem pole. The modules are rated to 1200 V and feature a low on-resistance (47 mΩ) that reduces conduction losses, allowing higher conversion efficiencies and more power density.  


ACEPACK DMT-32 SiC Module.

ACEPACK DMT-32 SiC Module. Image used courtesy of ST


ST’s ACEPACK technology uses high-performance DBC (Direct Bond Copper) AlN insulated substrates that rapidly remove heat from the module to avoid exceeding thermal limits during high-power operations. An operating junction temperature of 175°C supports reliable operation at elevated power levels, and an onboard NTC sensor allows for direct temperature monitoring.    

With its high level of component integration, the ACEPACK DMT-32 module simplifies power system design while reducing BOM count, board space, and solution cost.


ACEPACK DMT-32 SiC Module bridge configurations.

ACEPACK DMT-32 SiC Module bridge configurations. Image used courtesy of ST


In addition to vehicle charging and powertrain applications, the power modules can also be used in EV auxiliary system applications, like fluid pumps and climate control, often powered directly from an EV’s high-voltage battery bus.   

The first model in the ACEPACK series, the M1F45M12W2-1LA, is a four-pack configured device that began volume production in the past few weeks. Five additional models supporting the available configurations are currently sampling and will be released to full production through Q1 2024.  


Onsemi Expands Silicon Carbide Production

Onsemi has completed the expansion of its SiC wafer production facility in Bucheon, South Korea. When fully operational, the state-of-the-art facility can manufacture more than one million SiC wafers yearly, or several hundred million SiC power MOSFET devices – enough to power more than 10 million EVs.


Bucheon, South Korea

Bucheon, South Korea. Image used courtesy of onsemi


Completion of the fab expansion comes as automotive e-OEMs and Tier 1 suppliers continue to aggressively pursue long-term supply agreements to lock in supply of the critical high-voltage SiC components essential to modern EV design and necessary for meeting future demand for EVs.    

The facility will initially produce 150 mm SiC wafers but will expand to larger 200 mm wafer production by 2025. Along with SiC wafer production, the facility has EPI layer development capabilities essential to device formation with the SiC wafers. 


Silicon carbide supply chain.

Silicon carbide supply chain. Image used courtesy of onsemi


The expansion project first broke ground in 2022 and is part of a larger effort by onsemi to develop a fully integrated SiC supply chain capable of meeting future demand.    

In addition to EVs, high-voltage SiC power devices are important to next-generation renewable production, energy storage, and other e-mobility applications that place a premium on high power density and conversion efficiency.