Fairchild Answers DC-DC Design Challenge for High Efficiency in a Tiny Footprint
Fairchild Semiconductor has launched a MOSFET family that it says enables thinner, lighter and more compact power supply solutions, while continuing to deliver high efficiency and excellent thermal enhancements.
The FDMC7570S, a 25V MOSFET, delivers what the company says is the lowest RDS(ON) in a 3 x 3mm MLP package in the industry – providing unmatched efficiency and junction temperature improvements. With an RDS(ON) of 1.6mΩ at 10VGS (2.3mΩ 4.5VGS), it delivers 50% lower conduction losses than alternate solutions in the same form factor – bringing designers the highest power density achievable today. All of these improvements are a direct result of Fairchild’s advanced proprietary PowerTrench® process technology, which yields an exceptionally low RDS(ON), total gate charge (QG) and Miller Charge (QGD). As an added benefit, these MOSFETs feature a proprietary shielded gate architecture which reduces undesired high-frequency switching noise.
In addition, the output capacitance (COSS) and reverse recovery charge (Qrr) have been minimized to reduce synchronous MOSFET losses in a buck conversion – enhancements that result in high peak efficiencies, presently unmatched by lateral devices.
In addition to the 25V FDMC7570S, Fairchild’s new MOSFETs include the 30V FDMC7660S and the FDMC7660. These devices are available in the ultra-compact Power33, 3.3 x 3.3mm MLP package.
The devices are priced (1,000 piece quantities) as follows: FDMC7570S - US $2.14; FDMC7660S - $1.80; and FDMC7660 - $0.99 – with a delivery of 8 weeks ARO.
