ATS Announces New Active and Passive Heat Sinks for Cool Freescale Dual-Core Processors
Advanced Thermal Solutions, Inc. (ATS) announced it is introducing two new heat sink solutions for cooling Freescale Semiconductor's MPC8641D Dual-Core PowerPC® Processors, after more than a year of design and testing. ATS is demonstrating the two new cooling solutions as well as its maxiGRIP™ technology, at the Freescale Technology Forum.
The ATS-405 "Juneau" active heat sink includes an integral fan for optimum cooling performance. The ATS-474 "Anchorage" passive heat sink incorporates ATS' maxiFLOW™ fin angled fin technology and is specially designed to provide high levels of cooling in low airflow conditions. Both heat sinks provide optimal cooling for Freescale MPC8641D processors in enclosures such as ATX cabinets, blade servers and 1U to 4U rack-mount chassis.
The ATS-405 "Juneau" active heat sink includes an integral fan to enhance cooling performance where minimum airflow is available. The fan blows air through a linear field of flat aluminum fins on the heat sink. The required thermal performance for the 8641D processor is 0.7 degrees C/W under given load and die area specifications. The ATS-405 sink delivers thermal resistance of just 0.51 degrees C/W with thermal grease. This performance provides an 18% margin of safety over the specified thermal resistance. The 405 fan sink assembly screw mounts to the PCB and stands just 54.9 mm high.
The ATS-474 "Anchorage" passive heat sink was developed to cool Freescale MPC8641D processors in restricted height enclosures, such as 2U racks, where airflow is limited. The "Anchorage" heat sink features 26 various sized, spaced, and angled fins to maximize exposure to available air. Testing of these sinks shows thermal resistance of only 1.05C degrees/W in air velocity of 100 LFM, and just 0.49 degrees C/W in air velocity of 400 LFM. The 474 heat sink is just 30.6 mm high and screw mounts directly to the PCB.
