Dielectric with 3X Higher Thermal Conductivity than Cu
Litecool has produced LED packages using a new dielectric material that has a thermal conductivity of 1000 W/mK – 3-times higher than copper (Cu) and 30-times better than alumina ceramic. Dielectrics are used within LED packages to isolate electrical tracks but they hinder the thermal path causing the LED to overheat. Mid-lower, low-cost LED packages use plastic as the main dielectric material. High-power, high-cost LED packages use ceramics such as alumina as the dielectric. This new material, Black X™, has a thermal conductivity 30-times higher than alumina.
Litecool has successfully prototyped and tested LED packages using Black Xâ„¢ as the dielectric. The LED packages have a thermal resistance of between 0.2 degrees C/W and 0.5 degrees C/W depending on the construction. This is up to 6-times lower than the closest competitor which means the LED can be powered with 6-times more current without overheating.
â€œIt is an incredible material. We have always assumed dielectric materials will hinder the thermal performance of our LED packages but this material actually improves it. The thermal resistances of the LED packages we have made are so low we had trouble measuring it. We had to use 9 high-power LEDs in one package to give enough power density to record any difference in temperature.â€ Robert Corbin, Project Engineer, Litecool
â€œThis is a step change in the performance of an LED package. We will be able to hit new lumen density thresholds without the need for costly heat sinks, heat pipes or fans. We see this material initially being used in spot light applications for pin-point light sources but we also intend to incorporate it into our Lumen Block for the wider LED lighting market.â€ James Reeves, CEO, Litecool.