DayStar Technologies, Inc. has announced the appointment of Silicon Valley veteran Robert Weiss as Vice President of Advanced Technologies, to lead its recently created Equipment Development Group, located in Santa Clara, California.
The Equipment Development Group, which will include an initial staff of up to 10 employees, will be charged with prototype research and development and production of the roll-to-roll deposition equipment that will be used in DayStar's Gen III* production lines. Once testing is completed, the tools created in the Santa Clara facility will be transitioned to DayStar's planned expanded manufacturing facility in New York's Tech Valley.
Robert Weiss joins Daystar Technology, Inc. having most recently served as Chief Technology Officer of Intevac, Inc., a supplier of thin film deposition manufacturing equipment. During his career at Intevac, Mr. Weiss led hardware and process development teams in commercializing tools used in the production of plasma and polysilicon displays, hard disks, and low light cameras (Night Vision).
Prior to his work at Intevac, Mr. Weiss worked at the Varian Research Center and the Chevron Research Center on a variety of opto-electronic devices including gallium arsenide and cadmium sulfide solar cells. He holds eight patents/patents pending, and earned a BA from Grinnell College in Grinnell, Iowa.
"The new Equipment Development Group is integral to the advancement of DayStar's entry into equipment manufacturing and our first step into vertical integration. Bob Weiss is exceptionally well networked and highly regarded by the Silicon Valley community, just the combination required for this important position" said Dr. John Tuttle, Chairman and CEO of DayStar Technologies. "We are confident Bob, and the team he assembles, will enable us to expedite our factory capacity ramp-up here in New York, and will prove to be another valuable asset to our talented team and for our DayStar stakeholders," concluded Tuttle.
