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Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

News Oct 10, 2019 by Paul Shepard
Bosch Enters Automotive Silicon Carbide Race

Bosch Enters Automotive Silicon Carbide Race

News Oct 08, 2019 by Paul Shepard
Eval Board for New 4-Pin SiC MOSFETs with Up To 35% Lower Switching Losses

Eval Board for New 4-Pin SiC MOSFETs with Up To 35% Lower Switching Losses

News Oct 08, 2019 by Paul Shepard
AI Chip Design Platform to Boost Semiconductor Design Productivity and Quality

AI Chip Design Platform to Boost Semiconductor Design Productivity and Quality

News Oct 07, 2019 by Paul Shepard
Dialog Semi to Acquire Creative Chips adding IIoT Products to its Portfolio

Dialog Semi to Acquire Creative Chips adding IIoT Products to its Portfolio

News Oct 07, 2019 by Paul Shepard
Advancing Gallium-Nitride Microelectronics Technology for the Defense Community

Advancing Gallium-Nitride Microelectronics Technology for the Defense Community

News Oct 05, 2019 by Paul Shepard
Torex Semiconductor Forms an Alliance with India-based Cirel Systems

Torex Semiconductor Forms an Alliance with India-based Cirel Systems

News Oct 03, 2019 by Paul Shepard
WIN Semiconductors Offers Sample Kits for its GaN on SiC 0.15μm-gate Technology

WIN Semiconductors Offers Sample Kits for its GaN on SiC 0.15μm-gate Technology

News Oct 02, 2019 by Paul Shepard
3rd Edition Gallium-Nitride Textbook Focuses on Power Conversion Applications

3rd Edition Gallium-Nitride Textbook Focuses on Power Conversion Applications

News Oct 02, 2019 by Paul Shepard
100V, 5A Gallium-Nitride-Based Half-Bridge Development Board

100V, 5A Gallium-Nitride-Based Half-Bridge Development Board

News Sep 30, 2019 by Paul Shepard
Integrated Silicon III-V Chips to be Commercially Available in 2020

Integrated Silicon III-V Chips to be Commercially Available in 2020

News Sep 30, 2019 by Paul Shepard
Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC

Power Integrations Delivers One-Millionth GaN-Based InnoSwitch3 IC

News Sep 30, 2019 by Paul Shepard
Mitsubishi Develops Trench-Type SiC-MOSFET with Unique Electric-Field-Limiting Structure

Mitsubishi Develops Trench-Type SiC-MOSFET with Unique Electric-Field-Limiting Structure

News Sep 29, 2019 by Paul Shepard
Steifpower Selects SkyWater to Fab High Efficiency Discrete Power Devices

Steifpower Selects SkyWater to Fab High Efficiency Discrete Power Devices

News Sep 29, 2019 by Paul Shepard
SiC to Enable 1MW Inverter in the Size of a Compact Suitcase

SiC to Enable 1MW Inverter in the Size of a Compact Suitcase

News Sep 27, 2019 by Paul Shepard
Gallium Nitride Discovery Aims for Efficient P-Type GaN Transistors

Gallium Nitride Discovery Aims for Efficient P-Type GaN Transistors

News Sep 26, 2019 by Paul Shepard
New Open, Physical Interconnect Specification to Efficiently Connect Chiplets

New Open, Physical Interconnect Specification to Efficiently Connect Chiplets

News Sep 26, 2019 by Paul Shepard
10kW Bi-Directional, Dual Active Bridge Reference Design with SiC MOSFETs

10kW Bi-Directional, Dual Active Bridge Reference Design with SiC MOSFETs

News Sep 25, 2019 by Paul Shepard
II-VI Expands Compound Semi Business with Completion of Finisar Acquisition

II-VI Expands Compound Semi Business with Completion of Finisar Acquisition

News Sep 25, 2019 by Paul Shepard
Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million

Elmos to sell Silicon Microstructures Inc. to TE Connectivity for $95 Million

News Sep 24, 2019 by Paul Shepard