Each year, PowerPulse provides readers extensive coverage of important industry events, spanning the globe from Asia to Europe and North America, including the IEEE Applied Power Electronics Conference, PCIM Europe, Solar Power International, Techno Frontier Japan and electronica. The coverage typically starts running in advance of the event and continues with wrap-up stories after the event has concluded. The following are the ten most-read stories from PCIM Europe 2016:
#10: Precision 16V Op Amps Eliminate Post-Assembly Trimming
STMicroelectronics introduced the new TSX7 series of precision 16V op amps that combine very high accuracy with a wide operating-voltage range and excellent robustness. The low input-offset voltage, Common Mode Rejection Ratio (CMRR), and temperature drift eliminate any need for trimming or calibration in the assembled circuit while ensuring consistent performance over a wide automotive-grade temperature range from -40 to 125 degrees C. The new devices build on ST's advanced 18V analog manufacturing technology and the success of its TSX5, TSX6, and TSX9 series of low-power op amps. More.
#9: 1200V IGBTs based on Ultra Field Stop Technology
ON Semiconductor introduced a new series of IGBTs which utilize its proprietary Ultra Field Stop trench technology. The NGTB40N120FL3WG, NGTB25N120FL3WG and NGTB40N120L3WG are designed to deliver elevated levels of operational performance in order to meet the exacting demands of modern switching applications. These 1200V devices are able to achieve industry-leading total switching loss (Ets) characteristics; the remarkable improvement in performance is attributable in part to a very wide highly activated field-stop layer and optimized co-pack diode. More.
#8: Littelfuse to unveil new SiC Products at PCIM
During PCIM Europe 2016 in Nuremberg from May 10-12, Littelfuse, Inc. will be unveiling two new power semiconductor families: Silicon Carbide (SiC) Schottky diodes and silicon IGBT technology at its Booth 7-140 (Hall 7). In addition to showcasing its diverse product solutions portfolio, Littelfuse will launch the new LFUSCD Series of SiC Schottky Diodes and announce its own IGBT die technology. More.
#7: Power Modules for Hybrid and Electric Vehicles
The targets amount to only 95 gram CO2 per kilometer in Europe, 121 g/km in the US, 117 g/km in China and 105 g/km in Japan. When electrifying existing car platforms, space constraints are a significant challenge. As the inverter has to be placed in the typically cramped engine department, it has to be as small as possible. Inverter size is mainly defined by the power modules employed. Consequently, these have to become smaller while at the same time providing sufficient power to actuate the electric drivetrain. The size of a power module, on the other hand, is defined by the power consumption of the power chips used inside, and the ability to cool these chips to stay below a maximum junction temperature. More.
#6: 3 Watt DC-DCs in a Compact SIP4 Package
RECOM's new 3 Watt dc-dc converter series, RI3, features a very compact size and ultra-high power density. Despite their small size, these modules can be operated over a very wide temperature range from -40 to +85 degrees C without derating. When derated down to 60% power, the modules can achieve up to +100 degrees C operating temperature. More.
#5: Superjunction MOSFETs Reduce both On-Resistance and EMI
Toshiba Electronics Europe pre-announced this week at PCIM 2016 the development of its next-generation of superjunction (SJ) deep trench semiconductor technology for high-efficient power MOSFETs. Devices based on the new DTMOS V process operate with lower EMI noise and reduced RDSon compared to previous DTMOS IV MOSFETs. Initial devices will be rated for 600V and 650V. More.
#4: 650V Superjunction MOSFETs in TO-Leadless Package
During last week's PCIM Europe event, Infineon Technologies AG launched a new device of the CoolMOSâ„¢ family: the CoolMOS C7 Gold 650 V in a TO-Leadless package. This combination of improved superjunction (SJ) semiconductor process and advanced SMD package design is delivering unparalleled performance in hard switching applications. The small footprint of this package brings power density advantages for server, telecom and solar applications. More.
#3: Vincotech Expands offering to Mid-Power Inverters
Vincotech today announced the launch of a new industry-standard low-profile package for mid-power inverters. Engineered mainly for industrial drives, solar power and UPS applications, the VINco E3 package raises the performance bar with its enhanced power density and reliability. More.
#2: Panasonic Showcases GaN, Thermal and Passive Solutions
Panasonic Automotive & Industrial Systems Europe today announced its technology lineup for PCIM (Power Conversion Intelligent Motion) 2016, taking place May 10th -12th in Nuremberg, Germany. At Stand 429 in Hall 6 the company will be highlighting industry-leading innovations — including passive components, semiconductors and thermal management solutions — that provide increased efficiency and reliability for a wide range of applications. More.
#1: All-SiC Half-Bridge Power Module & Gate Driver Combination
Wolfspeed, A Cree Company, has introduced the first fully-qualified commercial power module from its Fayetteville, Arkansas location. The high-performance 62mm module represents a new generation of all-SiC power modules that enable unprecedented efficiency and power density for high current power electronics, such as: converters/inverters, motor drives, industrial electronics, and high performance electric vehicle systems. The new module allows systems designers to realize lighter weight systems that are up to 67% smaller by achieving efficiencies of over 98% and improvements in power density of up to 10 times compared to systems built with silicon-based technologies. More.
