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The Journey From One to a Million HiPaks

The Journey From One to a Million HiPaks

The history of the Swiss and Swedish companies that became ABB reflects the history of power electronics in both countries. In Switzerland, Charles…


Redefining Power Conversion

Redefining Power Conversion

Beyond just performance and cost improvement, the most significant opportunity for GaN technology to impact the power conversion market comes from…


tech insights May 11, 2020 by Alex Lidow
Materials Science Changes the Electronics World: An Interview with Dr. Andy Mackie of Indium Corporation

Materials Science Changes the Electronics World: An Interview with Dr. Andy Mackie of Indium Corporation

Dr. Andy Mackie, Senior Product Manager of Semiconductor and Advanced Assembly Materials at Indium Corporation talks about the company as a premier…


Optimizing Energy: An interview with Peter Kamp of EcoCircuits

Optimizing Energy: An interview with Peter Kamp of EcoCircuits

In this interview, EcoCircuits CEO Peter Kamp spoke with EE Power Editor Hailey Stewart about optimizing chips for the energy management field and…


Developing Next Generation Energy Management: An Interview with Huw Davies of Trameto

Developing Next Generation Energy Management: An Interview with Huw Davies of Trameto

In this interview, Trameto CEO Huw Davies spoke with EE Power Editor Hailey Stewart about working with Silicon Catalyst as a young company in the…


Finding Solutions in Silicon: An Interview with Richard Curtin of Silicon Catalyst

Finding Solutions in Silicon: An Interview with Richard Curtin of Silicon Catalyst

In this interview, EE Power editor Hailey Stewart spoke with Silicon Catalyst Managing Partner Richard Curtin about how silicon-based startup…


Partnering in SiC MOSFETS to Deliver Automotive and Industrial Solutions

Partnering in SiC MOSFETS to Deliver Automotive and Industrial Solutions

An interview with Dr. Rainer Käsmaier about SiC-based products in the rapidly growing power semiconductor market.


Innovative Power Capacitor Technologies Support SiC and GaN in DC Link

Innovative Power Capacitor Technologies Support SiC and GaN in DC Link

At its annual Technologies & Products Press Conference 2019 in Munich, TDK managers Dr. Lucia Cabo and Fernando Rodríguez presented film…


The Benefits of 3Level Topologies in Combination with 7th  Generation IGBT Technology

The Benefits of 3Level Topologies in Combination with 7th Generation IGBT Technology

Over the past few months, SEMIKRON has introduced 950V and 1200V Generation 7 IGBTs from two different manufacturers.


WBG Semiconductors to Take Spotlight at Power Electronics Conference

WBG Semiconductors to Take Spotlight at Power Electronics Conference

Power electronics is rapidly moving to wide-bandgap (WBG) semiconductors as the gateways to more efficient designs for a host of high growth…


Innovative Driver Solutions for all Power Semiconductors: An interview with Rob Weber of AgileSwitch

Innovative Driver Solutions for all Power Semiconductors: An interview with Rob Weber of AgileSwitch

A VIP-Interview with Rob Weber, CEO of AgileSwitch LLC, about the company’s focus on Industrial and Transportation applications.


The Future of GaN: An Interview with Alex Lidow of EPC

The Future of GaN: An Interview with Alex Lidow of EPC

Ahead of December’s Power Conference in Munich, Bodo Arlt took the opportunity to get an insight into Dr. Alex Lidow’s thoughts on where the…


tech insights Nov 11, 2019 by Bodo Arlt
Have GaN Transistors Become as Easy to Use as MOSFETs

Have GaN Transistors Become as Easy to Use as MOSFETs

I began writing this article with the expectation that the answer to whether GaN transistors have become as easy to use as MOSFET would be…


tech insights Oct 31, 2019 by Scott Wolf
Competing Integrated GaN and NonGaN Technologies in USB Wall Chargers

Competing Integrated GaN and NonGaN Technologies in USB Wall Chargers

GaN brings compelling advantages in terms of efficiency for wall chargers and other power supply products, but achieving these in a cost-effective…


SiC Technology on Track to Power Formula E Racing Cars

SiC Technology on Track to Power Formula E Racing Cars

Journalists from all over Europe joined ROHM Semiconductor to enjoy the Formula E Race in Monaco this year. An eventful weekend with interesting…


The Next Step Sintering is the Key to Future Power Electronics

The Next Step Sintering is the Key to Future Power Electronics

In modern power electronics applications, requirements are becoming more demanding. Soldered connections are reaching their limits. Sintering is…


Wide Band Gap Devices are Mature PCIM Europe Overview

Wide Band Gap Devices are Mature PCIM Europe Overview

The demand for better efficiency in systems can only be achieved with better semiconductors that have less loss in conduction and switching in respect


tech insights Jul 05, 2019 by Bodo Arlt
International Electron Devices Meeting 2018 Reflections and Review

International Electron Devices Meeting 2018 Reflections and Review

The annual IEDM conference, held December 1-5, 2018 in San Francisco, CA, USA, is sponsored by the IEEE Electron Devices Society. It is the…


tech insights Feb 08, 2019 by Gary Dolny
Nexperia and Avnet Celebrate 50 Years of Success

Nexperia and Avnet Celebrate 50 Years of Success

Nexperia and global technology solutions provider Avnet announces it is celebrating a half-century of successfully working together with strong…


tech insights Jan 09, 2019 by Nexperia
ECPE Announces Workshops and Events for 2019

ECPE Announces Workshops and Events for 2019

ECPE recently released the program for its upcoming workshop 'New Technologies for Medium-Frequency Solid-State Transformers' taking…


tech insights Jan 07, 2019 by ECPE