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Dynex Launches New R&D Center

Dynex Launches New R&D Center

News Aug 07, 2012 by Jeff Shepard
Soraa Chosen to Lead DOE ARPA-E Project on Bulk Gallium Nitride Substrates

Soraa Chosen to Lead DOE ARPA-E Project on Bulk Gallium Nitride Substrates

News Aug 07, 2012 by Jeff Shepard
Mouser and Intersil Ink Global Distribution Agreement

Mouser and Intersil Ink Global Distribution Agreement

News Jul 17, 2012 by Jeff Shepard
Maxim Announces $200 Million Multiyear Investment to Upgrade its U.S. Manufacturing Facilities in Oregon, Texas and California

Maxim Announces $200 Million Multiyear Investment to Upgrade its U.S. Manufacturing Facilities in Oregon, Texas and California

News Jun 27, 2012 by Jeff Shepard
PCIM Asia Papers Focus on Powering White Goods, 3-D Televisions, and Consumer Electronics

PCIM Asia Papers Focus on Powering White Goods, 3-D Televisions, and Consumer Electronics

News Jun 21, 2012 by Jeff Shepard
Authors from Infineon, Fuji Electric and Vincotech Win Best Paper Honors at PCIM Asia

Authors from Infineon, Fuji Electric and Vincotech Win Best Paper Honors at PCIM Asia

News Jun 20, 2012 by Jeff Shepard
Silicon Carbide Drives Material Innovation for High Power Electronics

Silicon Carbide Drives Material Innovation for High Power Electronics

News Jun 05, 2012 by Jeff Shepard
Gregg Lowe Named President and CEO of Freescale Semiconductor

Gregg Lowe Named President and CEO of Freescale Semiconductor

News Jun 05, 2012 by Jeff Shepard
Tanaka Announces Replacement of Power Semiconductor Wire with Copper for Mass Production

Tanaka Announces Replacement of Power Semiconductor Wire with Copper for Mass Production

News May 28, 2012 by Jeff Shepard
Power Management Semiconductors Grow After a Rocky Q4 2011

Power Management Semiconductors Grow After a Rocky Q4 2011

News May 28, 2012 by Jeff Shepard
Solantro Semiconductor Secures $10 Million Series A Financing for Rollout of Chipsets for Solar PV Module Integrated Electronics

Solantro Semiconductor Secures $10 Million Series A Financing for Rollout of Chipsets for Solar PV Module Integrated Electronics

News May 24, 2012 by Jeff Shepard
EpiGaN Starts Production on Research Campus Hasselt

EpiGaN Starts Production on Research Campus Hasselt

News May 22, 2012 by Jeff Shepard
TI Drives Adoption of Copper Wire Bonding Technology

TI Drives Adoption of Copper Wire Bonding Technology

News May 22, 2012 by Jeff Shepard
Competition in Wide-Bandgap Devices: a Technical Session at PCIM 2012

Competition in Wide-Bandgap Devices: a Technical Session at PCIM 2012

News May 10, 2012 by Jeff Shepard
SiC and GaN Advances from Multiple Companies at PCIM

SiC and GaN Advances from Multiple Companies at PCIM

News May 08, 2012 by Jeff Shepard
Silicon Labs Online Power Consumption Calculator Simplifies Isolation Product Selection and System Design

Silicon Labs Online Power Consumption Calculator Simplifies Isolation Product Selection and System Design

News Apr 23, 2012 by Jeff Shepard
Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion cSoCs

Microsemi Expands Military Temperature Semiconductor Portfolio to Include SmartFusion cSoCs

News Apr 11, 2012 by Jeff Shepard
Renewed Innovation to Lift Power Electronics to $15 Billion in 2020

Renewed Innovation to Lift Power Electronics to $15 Billion in 2020

News Apr 03, 2012 by Jeff Shepard
Fairchild and Infineon Reach License Agreement for Automotive MOSFET H-PSOF TO-Leadless Packaging Technology

Fairchild and Infineon Reach License Agreement for Automotive MOSFET H-PSOF TO-Leadless Packaging Technology

News Apr 02, 2012 by Jeff Shepard
Dialog Semiconductor and TSMC Create Process Platform to Advance BCD Power Management Leadership

Dialog Semiconductor and TSMC Create Process Platform to Advance BCD Power Management Leadership

News Mar 29, 2012 by Jeff Shepard