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Ultra-Low Power Transistors Shown to Be Possible with Unique Material

Ultra-Low Power Transistors Shown to Be Possible with Unique Material

News Jan 04, 2019 by Paul Shepard
Osram and GaN Systems Develop Ultrafast and High-Power Laser Driver for LiDAR

Osram and GaN Systems Develop Ultrafast and High-Power Laser Driver for LiDAR

News Jan 03, 2019 by Paul Shepard
Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

News Dec 21, 2018 by Paul Shepard
Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology

Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology

News Dec 20, 2018 by Paul Shepard
Assessing the Promise of Gallium Oxide Power Devices

Assessing the Promise of Gallium Oxide Power Devices

News Dec 20, 2018 by Paul Shepard
Chip-type Ceramic Rechargeable Batteries Coming in April 2019

Chip-type Ceramic Rechargeable Batteries Coming in April 2019

News Dec 16, 2018 by Paul Shepard
Carbon-Doping Free GaN-on-Si Displays Better Dynamic R(on)

Carbon-Doping Free GaN-on-Si Displays Better Dynamic R(on)

News Dec 14, 2018 by Paul Shepard
Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process

Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process

News Dec 13, 2018 by Paul Shepard
Transphorm Ships Over a Quarter of a Million GaN Power Devices

Transphorm Ships Over a Quarter of a Million GaN Power Devices

News Dec 13, 2018 by Paul Shepard
Automotive Data Flow Processor Test Chip Announced by NSITEXE

Automotive Data Flow Processor Test Chip Announced by NSITEXE

News Dec 13, 2018 by Paul Shepard
GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR

GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR

News Dec 12, 2018 by Paul Shepard
World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

News Dec 10, 2018 by Paul Shepard
Phase-Change Memory Now Sampling for Automotive Microcontrollers

Phase-Change Memory Now Sampling for Automotive Microcontrollers

News Dec 10, 2018 by Paul Shepard
650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

News Dec 06, 2018 by Paul Shepard
New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

News Dec 06, 2018 by Paul Shepard
High-Voltage GaN Helps Inergy Disrupt the Solar Power Generator Market

High-Voltage GaN Helps Inergy Disrupt the Solar Power Generator Market

News Dec 04, 2018 by Paul Shepard
TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

News Dec 03, 2018 by Paul Shepard
UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering

UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering

News Dec 03, 2018 by Paul Shepard
Endura Technologies and UNISOC Pen Power Management Partnership

Endura Technologies and UNISOC Pen Power Management Partnership

News Nov 29, 2018 by Paul Shepard
EPC Expands Asian Team to Support Accelerating GaN Growth

EPC Expands Asian Team to Support Accelerating GaN Growth

News Nov 28, 2018 by Paul Shepard