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Developing Next Generation Energy Management: An Interview with Huw Davies of Trameto

In this interview, Trameto CEO Huw Davies spoke with EE Power Editor Hailey Stewart about working with Silicon Catalyst as a young company in the semiconductor space. 

January 23, 2020 by Hailey Stewart

Partnering in SiCMOSFETs to Deliver Automotive and Industrial Solutions: An Interview with Dr Rainer Ksmaier of ABB

To accelerate market entry into the high-growth electric vehicles (EV) sector, the partnerships expands the rollout of SiC-based products in the rapidly growing power semiconductor market.

January 14, 2020 by Roland R. Ackerman

Fast High Energy Discharge in Xenon Flashing Beacons

Xenon flashing beacons manufactured by WERMA Signaltechnik GmbH use special discharge capacitors from FTCAP (part of the Mersen Group).

December 20, 2019 by Jens Heitmann

Innovative Power Capacitor Technologies Support SiC and GaN in DC Link

At its annual Technologies & Products Press Conference 2019 in Munich, TDK managers Dr. Lucia Cabo and Fernando Rodríguez presented film capacitors with a new dielectric, which are best suited as DC link capacitors in high-temperature WBG semiconductor solutions.

December 18, 2019 by Roland R. Ackerman

The Benefits of 3Level Topologies in Combination with 7th Generation IGBT Technology

Over the past few months, SEMIKRON has introduced 950V and 1200V Generation 7 IGBTs from two different manufacturers.

December 13, 2019 by Bernhard Eichler

WBG Semiconductors to Take Spotlight at Power Electronics Conference

Power electronics is rapidly moving to wide-bandgap (WBG) semiconductors as the gateways to more efficient designs for a host of high growth applications.

November 22, 2019 by Jürgen Hübner

Diversifying Test and Measurement: An Interview with Kaitlyn Franz of Digilent

In this interview, EE Power editor Hailey Stewart discussed one of Digilent’s most popular mixed-signal USB oscilloscopes with Test and Measurement Product Marketing Manager Kaitlyn Franz. 

November 19, 2019 by Hailey Stewart

Artificial Intelligence in Power Electronics

Next Generation of Magnetic Components As an electronics engineer, I don´t work for the earnings but for seeing the circuits working. In this article,

November 15, 2019 by Jose Molina

The Future of GaN: An Interview with Alex Lidow of EPC

Ahead of December’s Power Conference in Munich, Bodo Arlt took the opportunity to get an insight into Dr. Alex Lidow’s thoughts on where the GaN market is now and where he sees the potential applications for the future.

November 11, 2019 by Bodo Arlt

Longer Battery Life for Tomorrows Design Challenges

TI Ensures Ultra-low IQ Power Management “ As we increasingly rely on smaller, smarter and more connected devices, the demand for power grows faster

October 18, 2019 by Roland R. Ackerman

Disrupting Conventional Electrical Power within Automotive

During a press conference in Munich, Patrick Wadden, Global VP of Automotive Business Development, and Robert Gendron, P.E., Corporate VP, Product Marketing

September 05, 2019 by Roland R. Ackerman

The Smarter E Europe 2019 Consolidated its Status as Europes Largest Energy Trade Fair

Innovation Platform for the New Energy World In mid-May and in 10 halls of the exhibition grounds, Munich hosted four trade fairs with a common mission:

July 10, 2019 by Roland R. Ackerman

The Next Step Sintering is the Key to Future Power Electronics

In modern power electronics applications, requirements are becoming more demanding. Soldered connections are reaching their limits. Sintering is increasingly

July 08, 2019 by Roland R. Ackerman

Wide Band Gap Devices are Mature PCIM Europe Overview

The demand for better efficiency in systems can only be achieved with better semiconductors that have less loss in conduction and switching in respect

July 05, 2019 by Bodo Arlt

Supercapacitors Offer Growth in Additional Market Segments QampA with Eaton

Supercapacitors have been around for decades, offering a longer lifetime and less maintenance than their lead-acid battery counterparts and powering applications

March 08, 2019 by EE Power Editorial

International Electron Devices Meeting 2018 Reflections and Review

The annual IEDM conference, held December 1-5, 2018 in San Francisco, CA, USA, is sponsored by the IEEE Electron Devices Society. It is the world’s largest

February 08, 2019 by Gary M Dolny

IEEE Energy Conversion Congress and Expo 2018

Energy Conversion Congress and Expo (ECCE)—the foremost IEEE conference in the field of electrical and electromechanical energy conversion—provided

December 05, 2018 by Gary M Dolny

Getting Innovative Power Electronics Designs to Market Faster and Easier Interview with Graham Maggs of Mouser Electronics

In this interview, US correspondent for Bodo's Power, Henning Wriedt, speaks with Graham Maggs, VP Marketing for Europe at Mouser Electronics, about the

November 05, 2018 by Henning Wriedt

The Difference Between Accurate and Precise in Test amp Measurement Interview with Kelvin Hagebeuk

In this interview, Roland R. Ackermann met with Kelvin Hagebeuk, Marketing Manager of Test & Measurement for Yokogawa Europe. They discussed Yokogawa's

November 02, 2018 by Roland R. Ackerman

Leading the Development of HighPerformance Analog Power Products Interview with Analog Devices039 Tony Armstrong

“In this interview with Tony Armstrong, Marketing Director, Power Products at Analog Devices, Henning Wriedt got a chance to discuss ADI’s position

October 08, 2018 by Henning Wriedt