Latest Assemblies & Enclosures Technical Articles

Bidirectional Wireless EV Charging and Smart Grid Integration

This article highlights Finepower

Substation Shielding Methods for Lightning Strikes

This article explains different substation shielding techniques used to reduce the chance of and damage from direct lightning strikes.

Modular EMI Filter Selection for AC-DC Converters

This article highlights XP Power modular EMI filter selection for AC-DC converters.

Causes and Solutions of the Potential Induced Degradation (PID) Effect in PV Modules

Success Factors of EMC in the Design Phase

This article discusses electromagnetic compatibility and how it can prove difficult for developers and project managers.

Smarter Packaging for Demanding Power Applications

The new baseplate-less flow S3 package extends the power range of Vincotech’s well-established flow housing family. The housing is tailored for…

An Intelligent Power Module for High Switching Speeds

This article discusses the differences between SLIMDIP-L and SLIMDIP-W and investigates what suits the market demand for compact and…

Improving Vacuum Solder Reflow for Challenging Power Module Packaging

This article discusses the evaluation of flux-free soldering process for bare copper DBC substrate to Nickel-plated copper base plate soldering.

Increasing Power Density Consider Packaging and Silicon

This article features Nexperia's LFPAK package family designed to improve power density.

Getting the Best Performance from AC to DC Power Supplies in Abusive Environments

This article describes some common pitfalls of AC to DC Power Supplies and provides insight how to get maximum performance for specific applications.

High CV MLCC DC BIAS Capacitance Loss Explained

This article highlights EPCI European Passive Components Institute MLCC class II capacitors that results worsening of some electrical parameters.

11 Technical FAQs About the Danfoss DCMTechnology Platform for Automotive Traction Inverters

This article features Danfoss Silicon Power GmbH DCM™Technology Platform for Automotive Traction Inverters that covers an interview with…

Inevitability of Near Chip-Scale SMD Packaging for Power GaN and SiC

This article is a Q&A aiming to provide insight into the benefits of WBG near chip-scale package capability and its ultimate form, the μMaxPak…

Class 2 MLCC Dielectrics and the Case of the Missing Capacitance

This article discusses two different characteristics of the Multilayer Ceramic Chip Capacitors.

Combining Excellent Performance and Ease-of-Use with a Cost Effective Package Choice for Low Power Applications Compatible Solutions in SOT223

This article discusses the alternative and new devices that can maintain or improve the thermal performance of MOSFETs in power supplies.

Household Energy Storage Systems Power Solution

This article discusses power solutions to simplify design and increase system reliability of household energy storage systems.

Dry Film Capacitors for High-Frequency Power Electronics

This article discusses the requirements for power capacitors in systems seeking advantage in state-of-the-art high-frequency designs.

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…