Trench 9 MOSFETs in Robust Packages Save Space

Trench 9 MOSFETs in Robust Packages Save Space

Nexperia, the former Standard Products division of NXP, announces a series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine the company’s low voltage superjunction technology with its advanced packaging capability to deliver high performance and ruggedness. Five years ago, the company introduced the world’s largest range of automotive-qualified Power-SO8 MOSFETs. Now Nexperia is expanding this portfolio to include ultra-low RDS(on) parts that address the ever-increasing demand for higher power density in many typical automotive applications. The Trench 9 devices are all qualified to AEC-Q101, and exceed the requirements of this international automotive standard by as much as two times on key reliability tests including temperature cycling, high temperature gate bias, high temperature reverse bias and intermittent operating life.

LFPAK56E is the latest innovation in the family of automotive LFPAK packages from Nexperia. LFPAK56E is an enhanced version of the popular LFPAK56 package, with an optimised lead frame and package design that results in an improvement in RDS(on)  and power density of up to 30%. This improvement in power density enables the Trench 9 LFPAK56 MOSFETs to be used in applications previously only possible with D2PAK and D2PAK-7, delivering significant PCB space-savings.

More information: Nexperia