TRENCHSTOP Advanced Isolation Package for Discrete IGBTs

Infineon Technologies AG introduces the package technology TRENCHSTOP™ Advanced Isolation. It is available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. The two versions are performance optimized to replace both fully insulated packages (FullPAKs) as well as standard and high performance isolation foils. The new package targets applications like power factor correction (PFC) for air conditioner, uninterruptible power supply (UPS) and power converters for drives. 

By removing the need for isolation materials and thermal grease, designers can reduce assembly time by up to 35 percent. At the same time they improve reliability by eliminating misaligned foils. The thermal resistance (R th) of the new package is 50 percent lower than with a TO-247 FullPak and 35 percent lower than a standard TO-247 with an isolation foil. These improvements translate into a better performance such as a 10° C lower operation temperature than a FullPak with similar IGBT. Using the Advanced Isolation package, system efficiency can be increased by 0.2 percentage points over standard TO-247 with isolation foil. 

The package also has a low coupling capacitance of just 38 pF, which means better EMI performance and potentially smaller filters. The improved thermal characteristics can also contribute to better reliability because the IGBT will run at a lower temperature which reduces stress on the component. 

About Infineon

Infineon Technologies AG is a world leader in semiconductor solutions that make life easier, safer and greener. Microelectronics from Infineon is the key to a better future. In the 2019 fiscal year (ending 30 September), the Company reported sales of €8.0 billion with about 41,400 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange and in the USA on the over-the-counter market OTCQX International Premier.