Technical Articles    

Addressing the Challenges of Utilizing IGBT Technology in Power Modules

Power semiconductors are getting thinner, smaller, and faster, and the challenges for manufacturers that employ the latest chip technology in their power modules are ge

Daniel Hofmann

Product Release    

UnitedSiC Expands SiC JFET Portfolio with Gen-3 1200V and 650V Options

UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces its Generation 3 1200 V and 650 V silicon carbide JFETs, expanding its existing unique po

Technical Articles    

DCM Power Modules: Enabling the Electrification of Drive Train Technology

In the third quarter of 2018, global cumulative passenger electric vehicle (EV) sales hit four million.

Max-Josef Kell, Martin L. Kristensen, Ole Mühlfeld, Omid Shajarati, Robert Roesner, Tim Rettmann

Technical Articles    

IGBT Modules: Advanced Acoustic Micro Imaging

IGBT modules sometimes exhibit warpage of the ceramic raft, which can cause distortion of the desired even distribution of heat from the die and result in stresses that can

Tom Adams

Technical Articles    

TRENCHSTOP IGBT 7: A Good Fit for Industrial Drives

Electric-motor systems consume nearly half of all electric energy generation [1].

Benjamin Sahan, Yizheng Zhou, Ainhoa Puyadena Mier, Uwe Jansen, Alexander Philippou, Max Seifert, Christian R. Müller and Christian Jaeger,

Technical Articles    

Gaining Speed: Mitsubishi Electric SiC-Power Modules

Back in September 2017, we published an overview in Bodo's Power about the history and status of our SiC-power modules covering a wide range of commercially available S

Junji Yamada, Eckhard Thal

Product Release    

Full-SiC 1200V 500A Low Inductance H-Bridge / Phase-leg Module in Standard Footprint

Proton-Electrotex introduces MCDA – an advanced 1200V full-SiC module in well-known footprint, featuring an ultra-low inductance HBridge design with excellent electrical an

Technical Articles    

Pushing the Limits of GaN-based Power Devices and Power Electronics

The InRel-NPower research project reaches for maximum power efficiencies in power electronics’ applications by exploring group III Nitride-basing powe

G. Meneghesso (University of Padova), J. Derluyn (EpiGaN nv), E. Meissner (FhG IISB), F. Medjdoub (CNRS), A. Banerjee (ON Semiconductor Belgium BVBA), J. Naundorf (Siemens AG), M. Rittner (Robert Bosch GmbH)

Technical Articles    

Dual-Core dsPIC Digital Signal Controller Enables Separate Code Design and Seamless Integration

The dsPIC33CH digital signal controllers (DSC) with two dsPIC DSC cores in a single chip have been released by Microchip for high-end embedded control applications.

Roland R. Ackermann

Industry News    

PowerSphyr and GaN Systems Lead the Wireless Charging Revolution

PowerSphyr, an innovator in wireless charging, and