Rogers Corporation Offers Efficient Cooling Solutions at SPIE Photonics West 2019

Rogers Corporation Offers Efficient Cooling Solutions at SPIE Photonics West 2019

Rogers Corporation’s Power Electronics Solutions (PES) group will once again contribute as a major exhibitor to one of the world’s largest events for photonic products and technologies: the upcoming SPIE Photonics West Conference and Exhibition. The conference and exhibition are scheduled for February 2-7, 2019, in San Francisco’s Moscone Center.

Photonics West is the world’s largest multidisciplinary gathering for lasers, photonics, and biomedical optics products and technologies, with more than 20,000 visitors expected to attend the week-long 2019 event. Photonics West includes a scientific conference with more than 4500 technical presentations in three topic areas (biomedical optics and biophotonics, laser sources and lasers, and optoelectronic materials and devices). It also features two exhibitions: the BiOS Expo, with 200 companies showing products and services on biomedical optics, and the SPIE Photonics West 2019 Exhibition, where attendees can visit representatives from more than 1300 global suppliers of lasers and photonics. Among those, Rogers PES will be showing their innovative material solutions for enhancing the performance of lasers and photonics components and systems. 


Rogers at Booth 4235 During the SPIE Photonics West 2019 Exhibition

Representatives from Rogers PES group (Rogers Germany GmbH) will be a part of the SPIE Photonics West 2019 Exhibition, available at booth 4235 to show samples of their latest material-based products and to offer advice on how to apply those products to lasers and photonics designs for effective thermal management and extended operating lifetimes. Among the many Rogers PES products on display at booth 4235 will be its curamik®families of cooling products, such as curamik CoolPerformance Plus. This active water-cooled laser diode cooler effectively removes the heat from high-power laser diodes in the tightest spaces, helping to enhance power efficiency and extend operating lifetimes. These curamik CoolPerformance Plus coolers are formed from OFHC copper for excellent thermal conductivity and ceramic substrate for high isolation, combining for a tightly controlled coefficient of thermal expansion (CTE) of 6.5 to 7 ppm/K from +25 to +300°C.

In addition to curamik CoolPerformance Plus, Rogers PES will show examples of its curamik CoolPower and curamik CoolEasy material-based laser and photonics cooling solutions. The curamik CoolPower and CoolPower Plus coolers are fabricated with multiple layers of pure copper for effective thermal dissipation in the smallest volumes possible. The coolers benefit from the unique curamik bonding process to achieve hermetic multilayer structures without solder or additional adhesive layers. The curamik CoolEasy coolers are especially designed for conductive cooling of high-power laser diodes and laser diode bars. These copper coolers can be precisely machined and milled to meet the flatness requirements for mounting to laser diodes and avoiding potential “hotspots” in laser diode circuits.  


Become a Member of the Design Support Hub

Rogers PES brings its more than 40 years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on ROLINX busbars, capacitor busbar assemblies and curamik ceramic substrates, a library of technical papers on product design and problem-solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub helps design engineers to increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design.

More information: Rogers Corporation