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PCIM Asia Conference Features Latest Power Electronics Research and Innovation

April 30, 2019 by PCIM Asia

PCIM Asia 2019 announces key presentation focuses, award finalists, and forums.

PCIM Asia is a leading international exhibition and conference for power electronics, intelligent motion, renewable energy, and energy management. Jointly organized by Shanghai Pudong International Exhibition Corp, Guangzhou Guangya Messe Frankfurt Co Ltd, and Mesago Messe Frankfurt GmbH, the fair will be held from 26 – 28 June at the Shanghai World Expo Exhibition and Convention Center. It is expected that the three-day show will attract over 8,000 visitors and host nearly 100 exhibitors, showcasing the latest products and technologies of power semiconductors and modules, power electronics components, power converters, test and measurement, and more.

One of the highlights of the exhibition is the PCIM Asia Conference, which will take place across the three-day fair period. As in the past, the conference will showcase the latest developments in silicon carbide (SiC) and gallium nitride (GaN) devices and their respective applications in renewable energy, transmission, and especially electric vehicles. This year, a total of 49 conference papers will be presented, including 27 oral presentations and 22 posters.

One of the major focuses of the 2019 edition will be the applications in the field of electrified transportation, which are also covered in two keynote speeches. These speakers and their presentation topics include:

Topic: Electric Vehicles Charging – An Ultrafast Overview
Speaker: Prof Drazen Dujic, Power Electronics Laboratory, Ecole Polytechnique Fédérale de Lausanne, Switzerland

Topic: Traction Motors and Power Electronic Drives of Electric Powertrains for Electrified Vehicles
Speaker: Dr William Cai, Jing-Jin Electric Technologies Co Ltd, China

 

In addition, there will be four brand new tutorial sessions led by renowned scholars, covering a wide range of advanced technologies in power electronics. Confirmed topics and speakers include:

Topic: Topology and Control of 3-level / Multi-level Converters
Presented by: Prof Yongdong Li, Tsinghua University, China

Topic: Power Converter Technology for Industrial Induction Heating
Presented by: Prof Dr Enrique J. Dede, University of Valencia, Spain

Topic: Basics of IGBT Modules Application in Power Stack Design
Presented by: Mr Jun Li and Mr Song Chen, Fuji Electric (China) Co Ltd, China

Topic: Advances in Planar Magnetics for High Frequency Switched Mode Power Supply
Presented by: Prof Ziwei Ouyang, Technical University of Denmark, Denmark

 

Furthermore, in recognition of the remarkable contribution made by those in the industry each year, The Best Paper Award and The Young Engineer Award will be granted to the winners from submissions that highlight the latest discoveries in power electronics.

 

Finalists of the Best Paper Award 2019

Presentation: Highly Reliable Protection of Power Module for Automotive Inverter Application
Speaker: Mr Baoqi Wang, Mitsubishi Electric & Electronics (Shanghai) Co Ltd, China

Presentation: An Integrated Gate Driver Solution for Silicon Carbide Semiconductor Applications
Speaker: Mr Hao Wang, Power Integrations, China

Presentation: A New Fast Reverse Recovery Super-Junction MOSFET for High Efficiency and Reliable EV Charging Applications
Speaker: Mr Sungnam Kim, ON Semiconductor, Korea

 

Finalists of the Young Engineer Award 2019

Presentation: A High-Power Miniaturised Wireless EV Charger with a New SiC-VMOSFET Driven Single-Ended Inverter
Speaker: Mr Yuki Tono, Osaka Institute of Technology, Japan

Presentation: Evaluation of the Square-Root-T Method in Junction Temperature Measurement
Speaker: Mr Haiyang Cao, Delta Electronics, China

Presentation: A Novel 20MHz DC/DC Resonant Converter with Soft-Switching Characteristics and Small Volume
Speaker: Mr Yueshi Guan, Harbin Institute of Technology, China

 

E-mobility Forum and Power Electronics Applied Technologies Forum to Cater to Strong Market Demand

At present, electric drives of an electric vehicle (EV) are mainly composed of silicon (Si) based power devices. However, higher requirements have been placed on the miniaturisation and weight reduction of electric drives due to the relentless development of EVs. Many manufacturers have therefore switched their choice of materials from Si to SiC, a third-generation semiconductor which has obvious advantages over traditional semiconductor materials.

In light of the huge application potential of silicon carbide devices and the surging demand for new-energy vehicles, PCIM Asia has been focusing on this sector in recent years. Apart from the E-mobility Zone, the E-mobility Forum, scheduled to take place on the first day of the show, is also expected to be one of the highlights of the fair. The theme of the forum this year will be the applications of charging and driving technology for new-energy vehicles and applications of different power electronics technologies. The forum will be led by renowned industry experts who will share their experiences on the technological breakthroughs and development trends of SiC devices. Currently, 13 exhibitors have already expressed their interest in participating at the forum in giving presentations to demonstrate their company's technical achievements.

Moreover, the well-received Power Electronics Applied Technologies Forum will return once again to foster business interaction between exhibitors and the audience. The forum offers an alternative gateway for exhibitors to promote their latest products and technologies. It is anticipated that over 30 presentations will be given, allowing participants to keep track of the latest industry trends and technological developments.

 

Online Registration

The online registration for the PCIM Asia Conference 2019 is now open. Interested parties can now register for the conference.

 

About PCIM Asia

PCIM Asia is an international exhibition and conference focusing on power electronic device industry chain in Asia. It is the first choice platform for domestic and foreign well-known device manufacturers to release new products and latest technologies.