Palomar Presenting Die Attach Solutions for Packaging Assembly at ProductronicaNovember 05, 2019 by EE Power Editorial
This article highlights Palomar Technologies SST 8301 Automated Vacuum Solder System, a single chamber for microelectronic and photonics package assembly.
Epoxy, eutectic and vacuum reflow process die attach solutions on display
Carlsbad, CA – October 29, 2019 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging assembly, announced that it will present a range of die attach solutions for applications such as power electronics/power modules, RF microwave, optoelectronics, and MEMS at Productronica in Munich, November 13 – 15, 2019.
Palomar Technologies offers a Total Process Solution for microelectronic and photonics package assembly. The solution includes automated die bonders, and vacuum reflow systems, along with contract manufacturing/process development and support services.
On display at Productronica will be the new SST 8301 Automated Vacuum Solder System, a single chamber automated system. The SST 8301 and the SST 8303, with three chambers, differ from the majority of vacuum soldering systems on the market by utilizing SST’s unique system of applying both vacuum and gas pressure for the soldering interface of key components inside power modules, dies to DBC, connectors/pins to DBC and DBC to base plate soldering.
In addition to the SST vacuum solder system, the Palomar 3880 Die Bonder, known as the most flexible die bonding system will be on display. The Palomar 3880 Die Bonder component placement die attach system features a state-of-the-art, integrated Z-Theta bidirectional 8-tool bond head, making it the fastest, most reliable, and flexible multiple die bonder on the market. Designed based on industry-proven capabilities, the Palomar 3880’s versatility includes both eutectic and epoxy die attach, flip chip, as well as a range of options in a single machine.
With its purchase of SST International, now known as SST Vacuum Reflow Systems, Palomar positioned itself as the premier global single source for precision assembly and hermetic packaging of electronic components and continues to innovate in the area of automated microelectronic and photonic packaging assembly machines.
Additionally, through its Innovation Centers in the US and Singapore and its Demo/Prototype Lab in Europe, Palomar provides both contract manufacturing as well as design and manufacturing process development that shortens lead time and improves product quality.
Palomar Technologies and SST Vacuum Reflow Systems can be found at Productronica in Hall B2, Booth #302.
About Palomar Technologies
Palomar Technologies makes the connected world possible by delivering a Total Process Solution™ for advanced photonic and microelectronic device assembly processes utilized in today’s smart, connected devices. With a focus on flexibility, speed and accuracy, Palomar’s Total Process Solution includes Palomar die bonders, Palomar wire, and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly, and Customer Support services, that together deliver improved product quality and yield, reduced assembly times, and rapid ROI.
With its deep industry expertise, Palomar equips customers to become leaders in the development of complex, digital technologies that are the foundation of the connected world and the transmission of data generated by billions of connected devices. Palomar solutions are utilized by the world’s leading companies providing solutions for datacom, 5G, electric vehicle power modules, autonomous vehicles/LiDAR, enhanced mobile broadband, Internet of Things, SMART technology, and mission-critical services.
Headquartered in Carlsbad, California, Palomar offers global sales, service and application support from its offices in the USA, Germany, Singapore, and China.