The German tech giant opened a new $1.2 billion wafer fab to expand its automotive chip production capacity.
June 22, 2021 by Shannon Cuthrell
Hitachi’s High-Tech subsidiary is building a new semiconductor engineering facility in Oregon, expecting growth across EV, autonomous driving,…
June 20, 2021 by Shannon Cuthrell
New York startup lands $498,000 from the Department of Energy to develop silicon carbide semiconductors and modules.
June 16, 2021 by Shannon Cuthrell
A German semiconductor manufacturer selects Oxford Instruments Plasma Technology’s PlasmaPro 100 ALE solution for creating gallium nitride-based…
June 13, 2021 by Stephanie Leonida
The Si2 Compact Model Coalition (CMC) has announced it will fund and help institute the standardization of a SPICE model for silicon carbide MOSFETs.
June 04, 2021 by Darshil Patel
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
June 01, 2021 by Shannon Cuthrell
A team of researchers from Linköping University (LiU) in Sweden has developed a new material design to make renewable energy from water.
May 29, 2021 by Alessandro Mascellino
APEC 2021 will be held virtually over four days in June. Here’s a preview of the popular annual power industry conference.
May 27, 2021 by Shannon Cuthrell
Infineon concluded a supply contract with Japanese wafer manufacturer Showa Denko, which offers high-demand silicon carbide (SiC) material.
May 19, 2021 by Shannon Cuthrell
A team of researchers led by the École Polytechnique fédérale de Lausanne (EPFL) have made a new discovery that could greatly increase the…
May 16, 2021 by Alessandro Mascellino
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new spaceborne devices.
May 09, 2021 by Alessandro Mascellino
Silicon Labs will sell its infrastructure and automotive unit for $2.75 billion, redirecting growth targets towards its IoT and wireless…
May 05, 2021 by Shannon Cuthrell
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
May 05, 2021 by Gary Elinoff
Oxford Instruments Plasma Technology and LayTec have announced a new partnership focusing on the development of compound semiconductor technologies.
May 02, 2021 by Alessandro Mascellino
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
April 29, 2021 by Stephanie Leonida
Scientists from the Nagoya Institute of Technology (NITech) have conducted innovative research about the role of impurities in Gallium Nitride…
April 25, 2021 by Alessandro Mascellino
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new program to develop GaN-based…
April 24, 2021 by Shannon Cuthrell
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process will be used for mass…
April 23, 2021 by Stephanie Leonida
UnitedSiC brings power systems engineers a new, registration-free tool that can help with quick decision-making when constructing power designs.
April 17, 2021 by Stephanie Leonida
Swansea University and Newport Wafer Fab receive government funds to help lead the UK toward net-zero carbon emission goals and clean up technology…
April 15, 2021 by Stephanie Leonida
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