Mechatronic Systemtechnik Unveils Proprietary Calotte Loader mWL.csJanuary 20, 2021 by Hailey Stewart
This article highlights Mechatronic Systemtechnik mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.
Villach, Austria - Mechatronic Systemtechnik a leading global supplier of automation equipment for semiconductor wafer handling, today announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.
Image courtesy of Mechatronic Systemtechnik
Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing.
Key features of the mWL.cs mechatronic calotte loader include:
Superior handling accuracy and repeatability — hand-off position measurement and auto-
teaching capabilities (<50µm)
Improved process traceability — host notification of Wafer ID, Cassette ID, Segment ID, and
position in the segment
loading areas for continuous processing
Impressive transfer times — high throughput of up to 240 wph that enables ROI within two
Dual size handling — customizable to handle 4”, 6”, 8”, or 6” & 8” (dual size)
Small footprint — less than
mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Founded in 1998, the company specializes in addressing the industry’s needs for reliable, safe, and fully automated handling of non-standard substrates — including stacked, thin, or warped wafers, and also eWLP, MEMS, TAIKO, bumped, and film frames.