Lever Actuated Spring Pin Socket for NXP’s MCUMay 21, 2018 by Ironwood Electronics
Ironwood Electronics recently introduced a new BGA socket addressing high-performance requirements for Microcontroller Unit CBT-BGA-6075. The contactor
Ironwood Electronics recently introduced a new BGA socket addressing high-performance requirements for Microcontroller Unit CBT-BGA-6075. The contactor is a stamped spring pin with 31-gram actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60C temperature rise. Socket temperature range is -55C to +180C. The socket also features a floating guide for precise ball to pin alignment.
The specific configuration of the package to be tested in the CBT-BGA-6075 is a BGA, 21x21mm, 0.8mm pitch, 501 position, 25x25 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint for nearby passive components, and uses a stiffener plate to support back side of the PCB and allows passive components to be placed via customized pockets. This socket utilizes clamshell lid with integrated compression mechanism. It is constructed with cam actuated lever lid with central opening for direct thermal characterization of silicon. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning the lever. This socket can be used for hand test and temperature cycling as well as debugging an application in development and MCU characterization.
About Ironwood Electronics
Ironwood Electronics is ISO9001:2008 certified and offers a wide selection of high performance adapters and sockets, plus experienced engineering for quick-turn customs. Ironwood Electronics offer probing, prototype, and SMT package emulation for all SMT packages. Ironwood Electronics products include High-bandwidth 40 GHz sockets for BGA/QFN, pitches down to 0.3 mm, only 2.5 mm larger than IC. Latest adapters include QFN/MLF package emulators, BGA high endurance test sockets, BGA production adapters, and back-to-back Xilinx-compatible BGA sockets. These adapters/sockets support the product life cycle. In the design cycle, engineers are able to test and develop products more quickly with Ironwood prototype and test adapters for all package type--along with the very high density 40 GHz BGA and QFN/MLF sockets. In production, Ironwood can help extend the product life of PCBs, using package converter technology to replace or upgrade original or obsolete components and provide small to high volume turn-key solutions.