High Density Power Amplifier IC Delivers New Levels of Performance

The PA164 and PA165 from Apex Microtechnology establish new benchmarks for power amplifier performance in a single chip design. By driving advances in packaging technology and utilizing Apex’s proprietary MOSFET silicon design, the PA164 and PA165 can deliver enhanced amplifier features and combinations of continuous and PEAK output current currently not available in an IC form factor that is also rated to operate on voltage supplies up to 220 volts.

The PA164 provides 1 amp continuous and 4 amps PEAK of output current, while the PA165 can deliver 10 amps PEAK. At these levels of performance, thermal management for a very compact package must be managed very carefully. The design of this IC utilizes separate supplies for the amplifier core and the output stage to help optimize the overall power dissipation capabilities. In addition, both devices are housed in an QFP style package with a heat slug on top to facilitate for mounting of a heat sink over a single device or on an “arrow” pattern of these devices. As a result, the devices are capable of dissipating up to 28 watts.

“With the increased in miniaturization of circuitry designs, board space has become a highly valuable commodity. The exceptional performance potential for these ICs make them an attractive solution across a wide number of potential applications requiring high power across multiple channels when board real estate is very tight,” explains Apex Strategic Marketing Director Jens Eltze. “Both the PA164 and PA165 can offer designers the opportunity to reduce the size of their overall circuity while saving valuable design time in achieving a final layout.”

Depending on the circuit design of the end system, external components can be used to set both the optimum gain and the bandwidth. Onboard system protection for these devices includes a user-defined, temperature compensated current limit and a temperature sensor output. The addition of an output disable function and an over-current flag simplify the implementation of robust failure protection on the system level.

The wide range of target applications include adjustable voltage and current sources, test equipment, piezo electric positioning, electrostatic transducers and deflection, and focusing for deformable mirrors.

In terms of electrical performance comparisons to other high performance power amplifiers, the table below stacks up the PA164 and PA165 to Apex’s own next highest rated IC -- the PA441.

 

SPECIFICATION PARAMETER	PA164	PA165	PA441
Output current continuous	1A	4A	60mA
Output current PEAK	4A	10A	120mA
Supply voltage operation	220V	220V	350V
Internal power dissipation	28W	28W	12W
Onboard over current protection	Yes	Yes	Yes
Overcurrent flag and output disable	Yes	Yes	No
Built-in temperature sensor	Yes	Yes	No
Power Bandwidth	55kHz	55kHz	35kHz
RoHS compliant	Yes	Yes	Yes
Package style	QFP style, heat slug on top (hermitically sealed package as option)	QFP style, heat slug on top (hermitically sealed package as option)	Plastic, surface-mount PSOP with heat slug – or – plastic, thru-hole, hermetic PIP with alumina ceramic substrate
Package footprint measurement	20mm x 20mm	20mm x 20mm	16mm x 14.8mm – PSOP 25.4mm x 4.72mm – PIP

Pricing, Availability and Evaluation Tools

Sample units of the PA164 and PA165 are available now for qualified applications, with production volumes targeted for Q1 2018. Per unit pricing for 1K product quantities will be sub $30.00 USD. An evaluation kit for rapid prototyping is scheduled to be available in early Q4 2017.

 

About Apex Microtechnology

Apex Microtechnology, a subsidiary of HEICO Corporation, is based in Tucson, Arizona. Apex designs and manufactures precision power analog monolithic, hybrid and open frame components for a wide range of industrial, test and measurement, medical, aerospace and military applications. Apex Microtechnology is a recognized leader for consistently developing products that lead the industry in terms of performance, quality, and reliability.

Apex Microtechnology, a subsidiary of HEICO Corporation, is based in Tucson, Arizona. Apex designs and manufactures precision power analog monolithic, hybrid and open frame components for a wide range of industrial, test and measurement, medical, aerospace and military applications. Apex Microtechnology is a recognized leader for consistently developing products that lead the industry in terms of performance, quality, and reliability.