Hesse Mechatronics Announces New Hires to Grow Battery and Energy Storage MarketsAugust 26, 2019 by Hesse Mechatronics
This article features Hesse Mechatronics announcement of the latest hires to address the growing business in the emerging battery and energy storage markets.
Hesse Mechatronics is pleased to announce our latest hires that will address our growing business in the newly emerging battery and energy storage markets. Both Louis and Mark will join Vicmark Divinagracia in our lab on campus at the University California-Irvine where we have our BJ855 and BJ985 Wire Bonders.
Louis Castellanos is a Sr. Field Service Technician with Hesse Mechatronics. In this role, Louis will service, provide process support, and develop wire bonding programs and process parameters for customer applications. Before joining Hesse Mechatronics, Louis spent eight years working for EV Grid. There he managed battery production for electric vehicles and energy storage. Louis is proficient in CAD modeling, prototyping, fabrication, battery assembly and testing. He developed unique wire bonding parameters for cylindrical cells and busbars. Louis, with his knowledge and experience, will assist finding new solutions and create cost-saving methods for customers such that these companies can reach their production goals.
Mark Newborn is a Sr. Supervisor Field Service and Applications Engineer with Hesse Mechatronics. In this role, Mark will support the company's wire bond product and services effort providing pre-sale applications, customer demonstrations, and on-site machine installations. Mark will be responsible for customer training and application support and assist with field service and applications scheduling of resources.
Image courtesy of Hesse Mechatronics.
Before joining Hesse Mechatronics, he spent nearly 20 years working with semiconductor equipment company Kulicke and Soffa Industries (KNS) where he managed the Engineering Lab at their R&D facility. Mark also brings with him over 20 years of experience in the areas of electronic repair, reverse engineering, metrology, and research and development. He proudly served 4 years in the United States Navy where he was responsible for numerous shipboard weapons systems. With his extensive management experience and strong technical background, Mark will assist in providing enhanced products and services to the customers of Hesse Mechatronics.
Hesse Mechatronics is a wire bonder manufacturer for ball, fine wedge, heavy wedge and ribbon. For more information on our product line, please visit our website at www.hesse-mechatronics.com For specific questions about this press release or if you would like to learn more about our wire bonders and services, please contact Mike McKeown at [email protected].
About Hesse Mechatronics
Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes, ultrasonic Flip-Chip Bonders as well as customized tools and machines.
All relevant industrial companies engaged in assembly lean production wire bonder and connection technology (semiconductor manufacturers, HF/RF, automotive, medical etc.) are among the worldwide customers of Hesse GmbH. Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service. Furthermore, we have partner companies and co-operations in over 30 countries.