The first series member is a highly integrated half-bridge device aimed at wireless charging applications.
October 10, 2021 by Gary Elinoff
Paragraf, a spin-out company from the Department of Materials Science and Metallurgy of Cambridge University, has released a new Hall Effect sensor…
May 18, 2021 by Nicholas St. John
This article highlights STMicroelectronics reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices…
May 13, 2021 by Hailey Stewart
Chalmers University Researchers and international collaborators discover the advantages of using graphene-enhanced heat pipes for cooling…
December 14, 2020 by Stephanie Leonida
The new Micro Peltier Modules feature package sizes with dimensions from 3.4mm to 9.5mm with profiles as low as 1.95mm.
October 16, 2020 by Gary Elinoff
Tektronix’s mixed signal oscilloscopes are the first on the market to feature a greater than 2 GHz bandwidth while providing up to 8 input channels
September 27, 2020 by Gary Elinoff
The new units allow for high signal integrity and feature low clamping voltages along with high surge robustness.
September 23, 2020 by Gary Elinoff
This article highlights THERM-A-GAP GEL 37 as the next generation of single component, thermally conductive dispensable materials.
September 01, 2020 by Hailey Stewart
RECOM introduces a 230W 4”x 2” power supply featuring baseplate cooling and medical certification with enclosure options.
July 17, 2020 by Hailey Stewart
ABSOPULSE Electronics Ltd highlights PFL 2K-E/110-F6W, a switched-mode AC-DC power supply designed for rugged 2kW industrial applications that…
July 07, 2020 by Hailey Stewart
Exxelia launches its new 253P & 560P product series providing unmatched performances at high temperature.
June 30, 2020 by Hailey Stewart
Taiyo Yuden highlights the commercialization of multilayer ceramic capacitors with an increased maximum operating temperature of 150°C.
June 26, 2020 by Taiyo Yuden
Nexperia highlights the next-generation, 650-volt gallium nitride (GaN) technology for automotive, 5G, and datacenter applications.
June 18, 2020 by Antonio Anzaldua Jr.
In a recent collaboration with the Chalmers University of Technology, SweGaN introduced a 'buffer-free' concept for GaN-on-SiC electron…
June 12, 2020 by Antonio Anzaldua Jr.
CUI Inc. announces the addition of four high-density ac-dc power supply series to its medical product family.
June 09, 2020 by CUI Inc.
RECOM highlights RACM60-K series of 60W AC/DC power supplies that features full protection against short-circuits, output over-voltage,…
June 03, 2020 by RECOM
KEMET Electronics Corporation extends its popular KC-LINK range using KONNEKT high-density packaging technology.
June 02, 2020 by KEMET Electronics Corporation
TDK Corporation announces the introduction of the i7C series a 300W non-isolated, buck-boost DC-DC converters that have an output adjustment of…
May 28, 2020 by TDK-Lambda Corporation
TDK Corporation announces the introduction of the i7C series of 8A 300W rated non-isolated DC-DC converters, packaged with the industry-standard…
This article highlights products from Littelfuse, XP Power, Diodes, Flex Power Modules, and NIC Components.
May 13, 2020 by Alessandro Mascellino
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