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Innovative Power Capacitor Technologies Support SiC and GaN in DC Link

At its annual Technologies & Products Press Conference 2019 in Munich, TDK managers Dr. Lucia Cabo and Fernando Rodríguez presented film…

December 18, 2019 by Roland R. Ackerman

The Benefits of 3Level Topologies in Combination with 7th Generation IGBT Technology

Over the past few months, SEMIKRON has introduced 950V and 1200V Generation 7 IGBTs from two different manufacturers.

December 13, 2019 by Bernhard Eichler

WBG Semiconductors to Take Spotlight at Power Electronics Conference

Power electronics is rapidly moving to wide-bandgap (WBG) semiconductors as the gateways to more efficient designs for a host of high growth…

November 22, 2019 by Jürgen Hübner

Innovative Driver Solutions for all Power Semiconductors: An interview with Rob Weber of AgileSwitch

A VIP-Interview with Rob Weber, CEO of AgileSwitch LLC, about the company’s focus on Industrial and Transportation applications.

November 18, 2019 by Henning Wriedt

The Future of GaN: An Interview with Alex Lidow of EPC

Ahead of December’s Power Conference in Munich, Bodo Arlt took the opportunity to get an insight into Dr. Alex Lidow’s thoughts on where the…

November 11, 2019 by Bodo Arlt

Have GaN Transistors Become as Easy to Use as MOSFETs

I began writing this article with the expectation that the answer to whether GaN transistors have become as easy to use as MOSFET would be…

October 31, 2019 by Scott Wolf

Competing Integrated GaN and NonGaN Technologies in USB Wall Chargers

GaN brings compelling advantages in terms of efficiency for wall chargers and other power supply products, but achieving these in a cost-effective…

October 21, 2019 by Sinjin Dixon-Warren

SiC Technology on Track to Power Formula E Racing Cars

Journalists from all over Europe joined ROHM Semiconductor to enjoy the Formula E Race in Monaco this year. An eventful weekend with interesting…

July 12, 2019 by Holger Moscheik

The Next Step Sintering is the Key to Future Power Electronics

In modern power electronics applications, requirements are becoming more demanding. Soldered connections are reaching their limits. Sintering is…

July 08, 2019 by Roland R. Ackerman

Wide Band Gap Devices are Mature PCIM Europe Overview

The demand for better efficiency in systems can only be achieved with better semiconductors that have less loss in conduction and switching in respect

July 05, 2019 by Bodo Arlt

International Electron Devices Meeting 2018 Reflections and Review

The annual IEDM conference, held December 1-5, 2018 in San Francisco, CA, USA, is sponsored by the IEEE Electron Devices Society. It is the…

February 08, 2019 by Gary Dolny

Nexperia and Avnet Celebrate 50 Years of Success

Nexperia and global technology solutions provider Avnet announces it is celebrating a half-century of successfully working together with strong…

January 09, 2019 by Nexperia

ECPE Announces Workshops and Events for 2019

ECPE recently released the program for its upcoming workshop 'New Technologies for Medium-Frequency Solid-State Transformers' taking…

January 07, 2019 by ECPE

IEEE Energy Conversion Congress and Expo 2018

Energy Conversion Congress and Expo (ECCE)—the foremost IEEE conference in the field of electrical and electromechanical energy…

December 05, 2018 by Gary Dolny

Getting Innovative Power Electronics Designs to Market Faster and Easier Interview with Graham Maggs of Mouser Electronics

In this interview, US correspondent for Bodo's Power, Henning Wriedt, speaks with Graham Maggs, VP Marketing for Europe at Mouser Electronics,…

November 05, 2018 by Henning Wriedt

Mature Wide Band Gap Semiconductors in Systems A Tech Review of Presentations at PCIM

This article discusses some reflections and overviews on the discussions of leading representatives from the industry at PCIM Europe.

August 17, 2018 by Bodo Arlt

International Symposium on Power Semiconductor Devices and ICsISPSD 2018

The 30th Annual International Symposium on Power Semiconductor Devices and Integrated Circuits, (ISPSD) was held from May 13-17, 2018 in Chicago,…

July 10, 2018 by Gary Dolny

Interview Littelfuse Discusses Acquisition of IXYS Future of SiC and NonSiC Components

This article presents the discussions from an interview of Littelfuse on its acquisition of IXYS.

July 06, 2018 by Littelfuse

Interview ROHM Focuses on SiC Plus for Automotive and Industrial Markets

Bodo´s Power Systems recently interviewed Christian André, Heiko Metzger, Dr. Andreas Bauknecht, and Aly Mashaly, the management of ROHM Europe…

June 08, 2018 by Roland R. Ackerman

Semiconductors Bring Robots Closer to Humans

Robots have long been the workhorses on the production lines in modern factories. Manufacturers worldwide benefit in terms of increased…

June 06, 2018 by Peter Wawer