This article discusses how the cost differences can be bridged by the benefits of the 4x inductor size reduction, smaller heat sink and smaller…
3 days ago by Edgaras Mickus
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a…
March 21, 2020 by Power Integrations
The 3 kW ZHR483KS uses Transphorm’s GaN devices to reach 98 percent efficiency.
March 21, 2020 by Transphorm
Showcasing the performance of Gallium Nitride (GaN) power transistors in comparison to Silicon Superjunction MOSFETs (Si SJMOS) and Silicon Carbide…
March 20, 2020 by Jimmy Liu
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.
March 19, 2020 by Richardson RFPD
Toshiba Electronics Europe announced its new IGBT/MOSFET gate driver with additional built-in functionality.
March 19, 2020 by Toshiba Electronics Europe
The new 90 W PoE portfolio more than doubles standard PoE power and expands the capabilities of wireless access points and IoT wireless gateways.
March 19, 2020 by Silicon Labs
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher performance and smaller…
March 18, 2020 by EPC
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
March 16, 2020 by Microchip Technology Inc.
Pre-Switch's solution for the elimination of switching losses by incorporating AI into the Auxiliary Resonant Commutated Pole (ARCP)…
March 16, 2020 by Bruce Renouard
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy, provided by the RSL10 SIP,…
March 13, 2020 by ON Semiconductor
This article discusses UnitedSiC's state of the art low-resistance power semiconductor switches and their characteristics and application…
March 11, 2020 by Anup Bhalla
This article discusses the double pulse test data demonstrating that the Pre-Switch soft-switching platform reduces total system switching losses…
March 11, 2020 by Pre-Switch
ON Semiconductor has expanded its range of wide bandgap (WBG) devices with the introduction of two additional families of silicon carbide (SiC).
March 11, 2020 by ON Semiconductor
Hitachi highlights Silicon Carbide (SiC) 3.3 kV power module with the next generation package platform, nHPD2.
March 09, 2020 by Katsuaki Saito
The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.
March 09, 2020 by CISSOID
Dr. Andy Mackie, Senior Product Manager of Semiconductor and Advanced Assembly Materials at Indium Corporation talks about the company as a premier…
March 08, 2020 by Henning Wriedt
Exagan’s expertise will broaden and accelerate ST’s power GaN roadmap and business for automotive, industrial, and consumer applications.
March 07, 2020 by STMicroelectronics
The SLIMDIP™ family is the newest through-hole IPM, which offers reduced space and an optimized pin layout.
March 06, 2020 by Mitsubishi Electric
These new gate-drivers are perfectly are best used in high-reliability applications such as HVDC VSC, STATCOM/FACTS, and medium-voltage drives.
March 04, 2020 by Power Integrations
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