German semiconductor giant Infineon will host a virtual Wide-Bandgap Developer Forum on March 11. Here’s what attendees can expect.
4 days ago by Shannon Cuthrell
An international team of researchers manipulates the architecture of micro-supercapacitors to create a system that has the potential to power…
December 28, 2020 by Stephanie Leonida
December 15, 2020 by Hailey Stewart
The new units incorporate a digital interface and feature input to output isolation of 1500 volts
November 16, 2020 by Gary Elinoff
The article introduces the typical power circuits design flow and shows how the use of a simulator can provide great benefits.
September 11, 2020 by Luca Pellegrini
Smart homes are becoming more and more widespread across the globe, and with them, new systems must facilitate powerful 5G technologies.
May 03, 2020 by Alessandro Mascellino
The acquisition of Cypress Semiconductor is slated to strengthen Infineon's automotive market dominance
April 10, 2020 by Shannon Cuthrell
The MLC performs basic AI pre-processing of motion data using about 0.001 times the power a typical microcontroller (MCU) would consume.
March 14, 2020 by STMicroelectronics
This article highlights Rohde & Schwarz new option for the R&S RTO and R&S RTP oscilloscopes that helps in analyzing the individual…
January 28, 2020 by Rohde & Schwarz
NXP Announces it is First to Receive Common Criteria Certification for Standalone V2X Secure Element.
January 06, 2020 by NXP Semiconductors
International Aviation Electronics Supplier Outperforms Competition with GaN-driven Power Density Increases Transphorm Inc.—the leader in the…
December 21, 2019 by Transphorm
SYSGO and STMicroelectronics Demonstrate Secure Vehicle Connectivity at CES 2020.
December 19, 2019 by STMicroelectronics
This article highlights Rohde & Schwarz success for achieving new highs in terms of both revenue and incoming orders in 2018/2019 fiscal year.
December 09, 2019 by Rohde & Schwarz
This article features Renesas Electronics Corporation new RE01 Evaluation Kit that includes an evaluation board which features an RE01 embedded…
October 31, 2019 by Renesas
This article highlights Maxim Integrated MAX17301 and the MAX17311 1-cell, pack-side ICs, which offer the most configurable settings for battery…
August 21, 2019 by Maxim Integrated
This article highlights Rohde & Schwarz R&S®NGM200 series offer new features ideal for developing battery-powered equipment operating at…
August 20, 2019 by Rohde & Schwarz
This article highlights Bodo’s Power Systems US-Correspondent this year 56th Design Automation Conference (DAC) plus Exhibition took place in Las…
August 06, 2019 by Henning Wriedt
Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a definitive agreement under which…
June 03, 2019 by Infineon Technologies
This article introduces and discusses Vincotech's new flow E IGBT M7 and the upgraded MiniSKiiP® IGBT M7 product lines.
March 11, 2019 by Evangelos Theodossiu
The dsPIC33CH digital signal controllers (DSC) with two dsPIC DSC cores in a single chip have been released by Microchip for high-end embedded…
August 20, 2018 by Roland R. Ackerman
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