Latest Assemblies & Enclosures Articles

Maxim Introduces an Automotive 4-Channel TFT-LCD Power Supply

This article highlights Maxim Integrated MAX25222 4-channel TFT-LCD power IC that provides symmetrical positive AVDD and negative NAVDD supplies.

TDK Announces New MLCCs for Automotive Applications

This article highlights TDK MLCCs package such as 47 .mu.F products in 22 [mu] F and 3216 sizes (3.2x1.6.x1.6 mm) that started mass production in…

Infineon Technologies Unveils Secondary Side Regulated, Constant Voltage Flyback Controller

The XDPL8219 enables power factor correction to > 0.9, and total harmonic distortion of 10% or less.

Bonding Ribbon for the Next Generation of Power Electronics

he product enables power modules to be designed and manufactured more reliably, efficiently, and cost-effectively.

Bel Magnetic Solutions’ Single Port and Eight Port 2.5GBASE-T MagJack ICMs Now Available

Bel highlights single port and eight-port 2.5GBASE-T MagJack ICM. These ICMs that offer a cost-effective solution for upgrading end-product…

Causes and Solutions of the Potential Induced Degradation (PID) Effect in PV Modules

LinkSwitch-TN2 High-Voltage Switcher ICs from Power Integrations Now Certified for Automotive Use

Power Integrations announced its LinkSwitch-TN2, a high-reliability, space-saving buck/flyback switcher ICs targeting 400 VDC EV applications

Compact Panel Mounted Voltage Measurement with LEM DVC 1000 Series

LEM introduces the DVC 1000 series of voltage sensors for insulated nominal voltage measurements in rail traction and industrial applications.

Littelfuse Adds 105ºC Rated, 800V Solid State Relay to Product Line

Littelfuse announced the PLA172P OptoMOS® Relay, an 800 V normally-open single-pole 6-pin solid-state relay (SSR).

Electrolytic Capacitors with Energy Density and Multiple Packaging Options

Q Series capacitors from Cornell Dubilier are designed for use in monophasic and biphasic defibrillators with energy densities as high as 2 J/cc.

SWaP Benefits to Reduce Power Consumption in High Reliability Microprocessors

This article features Teledyne e2v High Reliability Microprocessors have been the workhorses across a broad range of defense, aerospace and other…

Electrolytic Capacitors with Energy Density and Multiple Packaging Options

Cornell Dubilier Electronics, Inc. (CDE) has made significant design tweaks to their groundbreaking THA and THAS Series Thinpack capacitors.

Power Product Recap

This article highlights new products from Analog Devices, CUI Incorporated, Riedon, and Microchip.

CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process

CEA-Leti (Leti-CEA) highlights the demonstation fabrication of a new gate-all-around (GAA) nanosheet device as an alternative to FinFET technology.

CUI Introduces High Density Internal AC-DC Power Supplies for Medical & Dental Applications

CUI Inc. announces the addition of four high-density ac-dc power supply series to its medical product family.

RECOM’s New Open Frame AC/DCs Feature High Efficiency

RECOM highlights RACM60-K series of 60W AC/DC power supplies that features full protection against short-circuits, output over-voltage,…

KEMET Extends KC-LIN Range Using KONNEKT High-Density Packaging Technology

KEMET Electronics Corporation extends its popular KC-LINK range using KONNEKT high-density packaging technology.

Success Factors of EMC in the Design Phase

This article discusses electromagnetic compatibility and how it can prove difficult for developers and project managers.