Lever Actuated Spring Pin Socket for NXP's MCU

Lever Actuated Spring Pin Socket for NXP's MCU

Ironwood Electronics recently introduced a new BGA socket addressing high-performance requirements for Microcontroller Unit CBT-BGA-6075. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60C temperature rise. Socket temperature range is -55C to +180C. The socket also features a floating guide for precise ball to pin alignment.

The specific configuration of the package to be tested in the CBT-BGA-6075 is a BGA, 21x21mm, 0.8mm pitch, 501 position, 25x25 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint for nearby passive components, and uses a stiffener plate to support back side of the PCB and allows passive components to be placed via customized pockets. This socket utilizes clamshell lid with integrated compression mechanism. It is constructed with cam actuated lever lid with central opening for direct thermal characterization of silicon. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning the lever. This socket can be used for hand test and temperature cycling as well as debugging an application in development and MCU characterization. 


 

More information: Ironwood Electronics