Integrated Circuits

Technical Article    

Simple Slew-Rate Control Technique Cuts Turn-ON Energy

The reduction of switching losses in power ele

Wolfgang Frank

Technical Article    

Presentation of HiRel Microprocessor, Innovative Data Converter and SiP Solutions

During a press briefing in Grenoble, Laurent Monge, President and Site Director, Evelyne Tur and Thierry Bissuel, Business Unit Directors, and colleagues gave an intere

Roland R. Ackermann

Technical Article    

Constant Current LED Drivers: Cost Efficient, Reliable, and Easy to Use

LEDs are widely used across all market segments.

Dr.-Ing. Jan Preibisch

Technical Article    

Making GaN Power Electronics Universal

As GaN power electronics is gaining momentum, an interesting question to ask is whether GaN will remain a niche player like GaAs or whethe

Simon Li, Ph.D.

Technical Article    

Power Control at 27 MHz with Variable Reactance

This is the second of a three part series.

David Pacholok, Paul Reich, Jim Spangler

Technical Article    

Cost Optimization of Wireless Power Transmission Systems

Advantages of wireless power transmission systems in comparison to standard plug contacts are easily identified.

Dominik Huwig

Technical Article    

Quasi-Class E Achieves Power Control and ZIS/ZVS

This is the first in a three-part series describing a novel approach to high frequency (27 MHz) power conversion and control.

David Pacholok, Paul Reich and Jim Spangler

Technical Article    

Building a Linear Charger for Wearable Applications

Wearable devices have become increasingly integrated into our lives.

Hank Cao

Technical Article    

Thévenin Equivalent Circuit and Maximum Power Transfer

The objective of this article is to verify Thévenin’s theorem by obtaining the Thévenin equivalent voltage (VTH) and Thévenin equivalent resistance (RTH) for

Antoniu Miclaus and Doug Mercer

Technical Article    

Temperature Stability Assessment of GaN Power Amplifiers with Matching Tantalum Capacitors

Wide bandgap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power conversion to RF transistors and MMICs.

T. Zednicek, European Passive Components Institute, Lanskroun, Czech Republic; R. Demcko, M. Weaver, D. West, AVX Corporation, Fountain Inn, SC, USA; T. Blecha, F. Steiner, J. Svarny, R. Linhart, RICE, University of West Bohemia, Pilsen, Czech Republic