Technical Articles
MiniSKiiP with a Silicon Nitride AMB Substrate
October 16, 2016 by Vince Botyánszki
Vince Botyánszki works as the Technology Development Engineer at Vincotech, Hungary where he is responsible for Direct Copper Bonded (DCB) or Direct Bonded Copper (DBC) substrates, soldering and washing, as well as housing. He is particularly skilled in the field of semiconductors, power electronics and research and development. He earned his Master's Degree in Information technology in Chemistry at the University of Pannonia located in Veszprém, Hungary.
October 16, 2016 by Vince Botyánszki