Product Release    

High Reliability 3.00mm Pitch Power Connectors & Cable Assemblies with 10A Current Capacity

In keeping with the company’s core objective of providing elevated levels of performance in the most compact of components, Harwin’s expansive M300 family comprises robust

Technical Articles    

Achieving Increased Solder Joint Reliability and Low Voiding in High Power Applications

Solder joints in higher power applications are being challenged like never before.

Tim Jensen, Sunny Neoh, Adam Murling, and Seth Homer

Technical Articles    

New Advances in Friction Stir Welding for Cold Plate Manufacture

The electronics world is ever evolving, and today the trend towards wearable products, VR, and the connected world decreases the size of many products.

John Broadbent

Product Release    

Harwin Introduces Ultra-Compact Fine Pitch Cable-to-Board Connector Offering

Continuing to extend the breadth of its interconnect solutions, Harwin has announced the latest addition to the

Product Release    

Rittal Introduces Smart and Small Power Distribution

Rittal North America LLC, the world’s largest manufacturer of industrial enclosures, enclosure accessories and machinery, introduces the RiLine Compact System for power dis

Product Release    

Fast Curing Thermally Conductive Epoxy Adhesive

A new fast curing Aluminum Filled Epoxy Adhesive (70-3814) was developed by Epoxies, Etc.  This thermally conductive adhesive has 1,000 psi of strength in just four hours! 

Technical Articles    

Bus Bars: The Art of Optimized Power and Signal Interconnectivity

Today’s inverter manufacturers, power electronics system integrators, and engineers throughout various industrial markets look for solutions to reduce assembly footprin

Dr. Philippe Roussel

Product Release    

SE 8 Enclosures Offer Better Value and Durability Than Unibody Enclosures

Rittal North America LLC, the world’s largest enclosure manufacturer and a leader in thermal management of electrical, electronic and IT equipment, introduces the SE 8 line

Technical Articles    

Optimizing the Thermal Performance of Power Electronics

While designers have always strived for efficiency within the field of power electronics, over the last five years, a combination of budgetary pressures, changing device li

Tom Gregory

Product Release    

Introduction of Advantage Substrates Family

Rogers Corporation’s Power Electronics Solutions (PES) group has announced the availability of curamik® ADVANTAGE, a family of features and process enhancements for its hig