Indium Corporation Features New InFORMS Solution for Die-Level Bonding at PCIM 2019

Indium Corporation Features New InFORMS Solution for Die-Level Bonding at PCIM 2019

Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.

Indium Corporation’s InFORMS® ESM02 is a reinforced matrixed solder composite that produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications. 

Previous InFORMS® technology was only applied at the baseplate level; however, new production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:

  • Drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability
  • Availability in ribbon and preforms
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Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.

More information: Indium Corporation