Introduction of Advantage Substrates Family

Introduction of Advantage Substrates Family

Rogers Corporation’s Power Electronics Solutions (PES) group has announced the availability of curamik® ADVANTAGE, a family of features and process enhancements for its high-power curamik® ceramic circuit substrate materials. The materials enable circuit designers to optimize the performance of their high-power circuits through a wide assortment of services and processes, including several plating options for improved copper surface finish, two different treatments for minimizing PCB surface roughness, selective etching, precise laser drilling of small-diameter through holes, addition of solder stop to prevent solder bridging, and optimization for advanced silver sintering process that offers an alternative to conventional solder device attachment. High-voltage curamik ceramic-based circuit materials include curamik Power, curamik Power Plus, curamik Performance, and curamik Thermal, offering a broad range of thermal conductivities from 24 to 170 W/m-K. The materials are especially formulated to effectively disperse heat in power electronics circuits with heat-generating, high-power active devices, such as IGBTs and MOSFETS. The curamik ADVANTAGE family of processes and services enhances both the usability and performance of the curamik materials, improving reliability in the process.

More information: Rogers Corporation